Micro LED array device mass transfer device and transfer method
A technology of transfer device and transfer method, which is applied in the manufacture of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., to achieve the effect of high yield and high transfer efficiency
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Embodiment 1
[0108] In the embodiment of this application, as Figure 6 as shown, Figure 6 The structural schematic diagram of the transfer device provided for Embodiment 1, the first carrier plate 20 and the second carrier plate 30 are located in the uniform magnetic field generated by the first magnetic pole 11 and the second magnetic pole 12, Micro LED100 Adsorbed by the adsorption element 21 on the first side surface of the first tray 20, the first side surface of the second tray 30 is opposite to the first side surface of the first tray 20, and when working specifically, Charge is applied to the Micro LED100 through the power-on device 21, the direction of the magnetic field is D1, the direction of movement of the first carrier 20 in the magnetic field is D2, and the direction of the magnetic field D1 is the same as that of the first carrier. The moving direction D2 of 20 is vertical, that is, the included angle θ between the direction of the magnetic field and the moving direction ...
Embodiment 2
[0110] In the embodiment of this application, as Figure 7 as shown, Figure 7 The structural schematic diagram of the transfer device provided for the second embodiment, the first carrier plate 20 and the second carrier plate 30 are located in the uniform magnetic field generated by the first magnetic pole 11 and the second magnetic pole 12, Micro LED100 Adsorbed on the first side surface of the first carrier 20 by the adsorption element 21, and apply charges to the Micro LED 100 through the power-on device 21, the first side surface of the second carrier 30 is connected to the first side surface of the first carrier 20. The first side surfaces of a carrier plate 20 are opposite, the direction of the magnetic field is D1, the first magnetic pole 11 and the second magnetic pole 12 move along the direction -D2, so that the first carrier plate 20 is in the magnetic field The direction of motion relative to the first magnetic pole 11 and the second magnetic pole 12 is D2, and th...
Embodiment 3
[0112] In the embodiment of this application, as Figure 8 as shown, Figure 8 The structural schematic diagram of the transfer device provided for the third embodiment, the first carrier plate 20 and the second carrier plate 30 are located in the uniform magnetic field generated by the first magnetic pole 11 and the second magnetic pole 12, Micro LED100 Adsorbed on the first side surface of the first carrier 20 by the adsorption element 21, and apply charges to the Micro LED 100 through the power-on device 21, the first side surface of the second carrier 30 is connected to the first side surface of the first carrier 20. The first side surface of a carrier plate 20 is opposite, the direction of the magnetic field is D1, the direction of movement of the first carrier plate 20 in the magnetic field is -D2, and the direction of the magnetic field D1 and the movement of the first carrier plate The direction D2 is vertical, that is, the angle θ between the direction of the magneti...
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