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Micro LED array device mass transfer device and transfer method

A technology of transfer device and transfer method, which is applied in the manufacture of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., to achieve the effect of high yield and high transfer efficiency

Active Publication Date: 2021-06-29
江西乾照光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is known that when making a Micro LED array device, a large number of Micro LEDs (tens of thousands to hundreds of thousands) need to be transferred to a circuit board to form a Micro LED array, so as to In the process of forming Micro LED array devices, very high transfer efficiency and transfer accuracy as well as a very high yield rate of Micro LEDs are required, which makes Micro LED mass transfer technology a major challenge in the development of Micro LED array devices.

Method used

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  • Micro LED array device mass transfer device and transfer method
  • Micro LED array device mass transfer device and transfer method
  • Micro LED array device mass transfer device and transfer method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0108] In the embodiment of this application, as Figure 6 as shown, Figure 6 The structural schematic diagram of the transfer device provided for Embodiment 1, the first carrier plate 20 and the second carrier plate 30 are located in the uniform magnetic field generated by the first magnetic pole 11 and the second magnetic pole 12, Micro LED100 Adsorbed by the adsorption element 21 on the first side surface of the first tray 20, the first side surface of the second tray 30 is opposite to the first side surface of the first tray 20, and when working specifically, Charge is applied to the Micro LED100 through the power-on device 21, the direction of the magnetic field is D1, the direction of movement of the first carrier 20 in the magnetic field is D2, and the direction of the magnetic field D1 is the same as that of the first carrier. The moving direction D2 of 20 is vertical, that is, the included angle θ between the direction of the magnetic field and the moving direction ...

Embodiment 2

[0110] In the embodiment of this application, as Figure 7 as shown, Figure 7 The structural schematic diagram of the transfer device provided for the second embodiment, the first carrier plate 20 and the second carrier plate 30 are located in the uniform magnetic field generated by the first magnetic pole 11 and the second magnetic pole 12, Micro LED100 Adsorbed on the first side surface of the first carrier 20 by the adsorption element 21, and apply charges to the Micro LED 100 through the power-on device 21, the first side surface of the second carrier 30 is connected to the first side surface of the first carrier 20. The first side surfaces of a carrier plate 20 are opposite, the direction of the magnetic field is D1, the first magnetic pole 11 and the second magnetic pole 12 move along the direction -D2, so that the first carrier plate 20 is in the magnetic field The direction of motion relative to the first magnetic pole 11 and the second magnetic pole 12 is D2, and th...

Embodiment 3

[0112] In the embodiment of this application, as Figure 8 as shown, Figure 8 The structural schematic diagram of the transfer device provided for the third embodiment, the first carrier plate 20 and the second carrier plate 30 are located in the uniform magnetic field generated by the first magnetic pole 11 and the second magnetic pole 12, Micro LED100 Adsorbed on the first side surface of the first carrier 20 by the adsorption element 21, and apply charges to the Micro LED 100 through the power-on device 21, the first side surface of the second carrier 30 is connected to the first side surface of the first carrier 20. The first side surface of a carrier plate 20 is opposite, the direction of the magnetic field is D1, the direction of movement of the first carrier plate 20 in the magnetic field is -D2, and the direction of the magnetic field D1 and the movement of the first carrier plate The direction D2 is vertical, that is, the angle θ between the direction of the magneti...

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Abstract

The embodiment of the invention discloses a Micro LED array device mass transfer device and a transfer method. The device comprises a first magnetic pole and a second magnetic pole which are used for generating a magnetic field; a first carrying disc is located in the magnetic field, the first carrying disc is provided with a plurality of adsorption elements, a power-on device and a first driving device, when the Micro LEDs are transferred, the power-on device is used for enabling the Micro LEDs to be electrified, and the first driving device is used for driving the first carrying disc to move; the value range of an included angle between the movement direction of the first carrying disc and the direction of the magnetic field is 0-90 degrees and does not include 0 degree so that the Micro LEDs have an acting force for separating from the first carrying disc; and a second carrying disc is positioned in the magnetic field and is used for adsorbing the transferred Micro LEDs. According to the transfer device provided by the embodiment of the invention, when the Micro LEDs are transferred, the Micro LEDs do not need to be subjected to process treatment so that the yield of the Micro LEDs in the transfer process is ensured, meanwhile, the transfer of a plurality of Micro LEDs can be realized, and the transfer efficiency is relatively high.

Description

technical field [0001] The present application relates to the field of semiconductor device manufacturing, and in particular to a mass transfer device for Micro LED array devices and a transfer method applied to the transfer device. Background technique [0002] Due to the advantages of high brightness, long life, high contrast, low energy consumption, large viewing angle, and high resolution, as well as the advantages of simple structure, small size, and self-illumination, Micro LED has been regarded as the next generation by many manufacturers. Display technology is widely used, among which, display devices represented by Micro LED array devices are the most widely used. [0003] It is known that when making a Micro LED array device, a large number of Micro LEDs (tens of thousands to hundreds of thousands) need to be transferred to a circuit board to form a Micro LED array to form a Micro LED array device. In this process, a very high The transfer efficiency and transfer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683H01L25/075H01L27/15
CPCH01L21/67709H01L21/67721H01L21/683H01L25/0753H01L27/156
Inventor 霍丽艳滕龙崔晓慧吴洪浩刘兆
Owner 江西乾照光电有限公司