Manufacturing method of electronic component module
A technology of electronic components and manufacturing methods, which is applied in the field of manufacturing electronic component modules, can solve problems such as difficult to achieve high precision and stable quality, and achieve the effect of saving time and stable quality
Inactive Publication Date: 2021-06-29
GUANGZHOU LUXVISIONS INNOVATION TECH LTD
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] The embodiment of the present application provides a method for manufacturing an electronic component module, which solves the problem that the current electronic component module is difficult to achieve high precision, stable quality and time-saving in the surface mount process
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[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0023] It should be noted that the order of the steps below is not fixed and indispensable, and some steps may be performed simultaneously, omitted or added. The flow chart describes the steps of the present application in a broad and simple manner, and is not intended to limit the sequence and number of steps of the manufacturing method of the present application.
[0024] The present application provides a manufacturing method of an electronic component module and a semi...
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Abstract
The invention discloses a manufacturing method of an electronic component module. The manufacturing method of the electronic component module comprises the steps of setting a substrate; printing solder paste on the substrate; coating an adhesive on the substrate by transfer printing; bonding a bonding pad and the substrate through the adhesive; arranging an adhesion element on the substrate; and carrying out reflow soldering on the bonded substrate. In the embodiment of the invention, the adhesive is coated between the substrate and the bonding pad so that the substrate and the bonding pad are prevented from deviating due to a stress or a specific heat difference before and in a reflow soldering process, and the product quality is not influenced. The manufacturing method provided by the invention realizes a surface mounting technology which is high in precision, stable in quality and time-saving.
Description
technical field [0001] The present application relates to the technical field of electronic component modules, in particular to a method for manufacturing an electronic component module. Background technique [0002] In the existing surface mount technology (Surface Mount Technology, SMT), usually a single printing of solder paste or flux on the substrate (for example, a flexible circuit board), and through the reflow process solder paste or flux Melting, thereby completing the soldering between the electronic component and the pad on the substrate. [0003] Due to the large area of the substrate and the pad, when the substrate and the pad or the pad and the pad are stacked up and down, their edges may be shifted or deformed due to tension or shear. In addition, before the solder paste is heated to the 180-degree solder joint, it may also be shifted or deformed due to the difference in specific heat. As a result, the accuracy of electronic components in the welding proce...
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Login to View More IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 周安都
Owner GUANGZHOU LUXVISIONS INNOVATION TECH LTD