Ejector pin unit, chip stripping and picking device and chip stripping and picking method

Abstract

The invention provides an ejector pin unit. The ejector pin unit comprises an elastic sheet and a first driving device connected with the elastic sheet; the first driving device is used for controlling the two ends of the elastic piece to move oppositely, so that the elastic piece protrudes upwards. The elastic sheets are configured to be bent upwards when the elastic sheets move towards each other; the ejector pin unit is used for bearing the chip and assisting stripping of the chip and the back film. In addition, the invention also provides a chip stripping and picking device comprising the ejector pin unit and a chip stripping and picking method. The elastic sheets are innovatively used as core components of the ejector pin unit, the elastic sheets protrude upwards due to extrusion to jack up the chip to realize stripping, the stripping process depends on the protrusion of the elastic sheets, and the protrusion of the elastic sheets is a gradually changing process, so that the stripping of the chip is very soft in the mode, and the condition of breakage is avoided. Different from a thin film inflation mode, the method does not need to consider the material of the thin film, does not need to consider an inflation control method, is easier to operate, and is higher in reliability.

Description

technical field [0001] The invention relates to the technical field of chip peeling and picking, and in particular to a thimble unit, a chip peeling and picking device, and a chip peeling and picking method. Background technique [0002] In recent years, flexible electronics has become a development hotspot due to its outstanding scalability, adaptability and portability. However, after flexible electronics such as flexible chips are cut on ultra-thin silicon wafers, they need to be peeled off from the back film for subsequent packaging. At present, there are many peeling schemes for chips. [0003] For example, the more traditional single thimble solution is replaced by the multi-thimble solution, which avoids the problem of cracking the flexible chip that is easily caused by the single thimble solution, but the multi-thimble solution is prone to the problem of incomplete peeling. [0004] There is also a multi-thimble grading scheme, which solves the problem that the ordi...

AI Technical Summary

Problems solved by technology

However, because the film thimble is inflated, it has high requirements on the material of the film, and the control accuracy of the inflation is also very high, resulting in high cost and poor reliability.

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