Magnetron sputtering equipment for plate synthesis and use method thereof

Abstract

The invention discloses magnetron sputtering equipment for plate synthesis and a use method thereof. The magnetron sputtering equipment comprises a base, a magnetron sputtering space is fixedly arranged on the top face of the base and used for conducting magnetron sputtering on plates, a first clamping disc is rotationally arranged in the position, on the lower side of the magnetron sputtering space, of the base, two temporary storage cavities used for storing plates are formed in the first clamping disc, a support is fixedly arranged on the right side of the magnetron sputtering space, a second clamping disc is rotationally arranged on the lower side of the support, the second clamping disc and the first clamping disc are of the same design, and the second clamping disc is used for temporarily storing the plates subjected to magnetron sputtering treatment. According to the magnetron sputtering equipment for plate synthesis and the use method thereof, automatic feeding of two plates can be achieved, magnetron sputtering is conducted on the plates serving as base plates, then the plates are automatically conveyed to a carrying plate, meanwhile, the two plates are automatically pressed and then transferred out, the whole equipment is high in automation degree and small in dependence on manpower, and manpower is saved.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering, in particular to a magnetron sputtering device for plate synthesis and a method for using the same. Background technique [0002] In the processing of plates, magnetron sputtering is often used to treat the surface of the plates, and then make the surface of the plates easy to be pressed with another plate. However, in the existing equipment, the substrate is usually subjected to magnetron sputtering first. processing, and then stored, transferred to the down-moving production line for pressing treatment, this method is more troublesome, and after the plate is processed by magnetron, the temperature remaining on the surface needs to be pressed in time, otherwise it will be transferred to the next equipment for processing Pressing requires reheating, which is troublesome and wastes energy. Moreover, traditional equipment loading is also troublesome. Therefore, it is necessary to desig...

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Problems solved by technology

[0002] In the processing of plates, magnetron sputtering is often used to treat the surface of the plates, and then make the surface of the plates easy to be pressed with another plate. However, in the existing equipment, the substrate is usually subjected to magnetron sputtering first. processing, and then stored, transferred to the down-moving production line for pressing treatment, this method is more troublesome, and after the plate is processed by magnetron, the temperature remaining on the surface needs to be pressed in time, otherwise it will be transferred to the next equipment for processing Pressing requires reheating, which is cumbersome and wastes energy, and traditional equipment loading is also troublesome, so it is necessary to design a plate processing equipment that integrates magnetron sputtering and pressing

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