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A kind of solder preform and preparation method thereof

A preformed soldering sheet and soldering tin technology, which is applied in the direction of welding equipment, manufacturing tools, welding media, etc., can solve problems such as uneven thickness of the solder layer, achieve uniform thickness, ensure uniformity, and improve reliability

Active Publication Date: 2022-04-05
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: the present invention provides a solder preform and its preparation method to solve the problem of uneven thickness of the solder layer of the package in the prior art

Method used

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  • A kind of solder preform and preparation method thereof
  • A kind of solder preform and preparation method thereof
  • A kind of solder preform and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Such as figure 1 with 2 As shown, the embodiment of the present invention provides a solder preform, which includes a solder sheet 1 and a positioning structure 2 , the positioning structure 2 is arranged on the surface of the solder sheet 1 , and the melting point of the solder sheet 1 is lower than that of the positioning structure 2 .

[0042] Based on the above settings, in the solder preform of the embodiment of the present invention, when the solder preform is placed on the packaging part, the solder preform is heated and welded, the solder preform 1 is melted to form a solder layer, and the positioning structure 2 is not melted. The positioning structure 2 plays a role in limiting the height of the welding layer, thereby ensuring the uniformity of the thickness of the welding layer, thereby making the heat dissipation of the welding layer uniform, and inhibiting the degradation of the welding layer after being impacted by cold and heat cycles, and improving the w...

Embodiment 2

[0054] The difference between this embodiment and the previous embodiments is that, as image 3 As shown, the solder piece 1 of this embodiment is made of Sn95Sb5, the positioning structure 2 is a quadrilateral nickel frame, and the positioning structure 2 is hot plated with In97Ag3 solder whose melting point is about 96°C lower than that of Sn95Sb5.

[0055] Such as image 3 As shown, the preform preparation method of the present embodiment includes the following steps:

[0056] S1, configure the soft solder according to the alloy composition of the solder sheet 1, the configuration of the soft solder is Sn95Sb5, and prepare the soft solder into a strip with a thickness of 0.25 mm;

[0057] S2, be the solder of the In97Ag3 that thickness is 0.025mm in the hot-dip one deck thickness on the nickel strip surface of 0.235mm;

[0058] S3, punching the nickel strip that is hot-plated with In97Ag3 solder into a quadrilateral nickel frame of required shape;

[0059] S4. Welding th...

Embodiment 3

[0063] The difference between this embodiment and the previous embodiments is that, as Figure 4 As shown, the material of the solder piece 1 in this embodiment is Sn63Pb37, and the positioning structure 2 is a triangular red copper frame.

[0064] Such as Figure 4 As shown, the preform preparation method of the present embodiment includes the following steps:

[0065] S1, configure the soft solder according to the alloy composition of the solder sheet 1, the configuration of the soft solder is Sn63Pb37, and prepare the soft solder into a strip with a thickness of 0.2 mm;

[0066] S2, punching the red copper strip with a thickness of 0.195mm into a triangular red copper frame;

[0067] S3, spot welding the triangular red copper frame in step S2 to the strip in step S1;

[0068] S4. Punching the strip in step S3 into solder preforms of required size.

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Abstract

The invention relates to the technical field of soldering of electronic components, and discloses a solder preform, which includes a solder sheet and a positioning structure, the positioning structure is arranged on the surface of the solder sheet, and the melting point of the solder sheet is lower than that of the solder sheet. Locate the melting point of the structure. The invention also discloses a method for preparing a preformed solder sheet, which includes the following steps: S1, configuring the soft solder according to the alloy composition of the solder sheet, and preparing the soft solder into a solder strip with a required thickness ; S2, punching the strip-shaped metal to obtain the positioning structure of the desired shape; S3, attaching the solder strip in step S1 to the positioning structure in step S2; S4, placing In step S3 , the solder ribbon with the positioning structure attached to its surface is punched out to obtain the solder preform of required size. The invention provides a preformed solder sheet and a preparation method thereof to solve the problem of uneven thickness of the solder layer of the package in the prior art.

Description

technical field [0001] The invention relates to the technical field of soldering of electronic components, in particular to a solder preform and a preparation method thereof. Background technique [0002] At present, with the development of electronic components in the direction of precision and integration, people's requirements for the packaging technology of electronic components are also increasing. It is understood that the thickness uniformity of the solder layer of the package plays an important role in the heat dissipation and reliability of electronic components. When the solder layer of the package has the problem of uneven thickness, it has the following disadvantages: [0003] (1) For the thicker part of the solder layer, the thermal resistance of the solder layer is larger. When the heat generated by the electronic components accumulates in the thicker part of the solder layer, the local temperature of the electronic components will be too high. And then cause ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/02B23K35/40
CPCB23K35/02B23K35/40
Inventor 蔡航伟李志豪林钦耀
Owner SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO LTD