Plate mounting device and leveling mounting method thereof

A technology of installation device and installation method, which is applied in the processing of building materials, covering/lining, construction, etc., can solve the problems of low construction quality and efficiency, affecting the progress of construction, and prone to errors, so as to save manpower and financial resources Lower expenditure, improved construction efficiency, and less dust

Pending Publication Date: 2021-07-23
普丽美家科技(北京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0002] The traditional integrated wall panel installation method is to hang the integrated wall panel on the original wall (or keel) at the calibrated size, and the other is to level the ground with cement mortar. Both methods are time-consuming and labor-intensive, and are prone to errors. The construction quality And the efficiency is not high, seriously affecting the progress of the construction

Method used

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  • Plate mounting device and leveling mounting method thereof
  • Plate mounting device and leveling mounting method thereof
  • Plate mounting device and leveling mounting method thereof

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Embodiment Construction

[0020] The technical solutions in the embodiments of the invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the invention. Obviously, the described embodiments are only part of the embodiments of the invention, not all of them. Based on the embodiments of the invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the invention.

[0021] In describing the invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", " The orientation or positional relationship indicated by "top", "bottom", "inner", "outer" and so on are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the invention and simplifying the description, rather than indicating or implying Any device or elemen...

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Abstract

The invention relates to a plate mounting device and a leveling mounting method thereof. The plate mounting device comprises profiles, grooves are dug in the profiles, and plates are inserted in the grooves of the profiles. The leveling method of the plate mounting device comprises the following steps that (1) firstly, the ground is leveled, the side faces of the profiles are attached to a structural wall, the bottom faces of the profiles are attached to the ground, and the profiles are fixed; and (2) the plates are sequentially inserted into the grooves of the profiles. By means of the mounting mode that the profiles are placed firstly, mounting can be convenient, the size and the horizontal precision in a decoration completed face can be accurately controlled, the mounting process is simple, the construction efficiency and the construction quality are obviously improved, manpower and financial expenditure is saved for enterprises, dust in the operation link is little, and the environment-friendly effect is good.

Description

technical field [0001] The invention relates to a device capable of rapidly installing wallboards and a process thereof. Background technique [0002] The traditional integrated wall panel installation method is to hang the integrated wall panel on the original wall (or keel) at the calibrated size, and the other is to level the ground with cement mortar. Both methods are time-consuming and labor-intensive, and are prone to errors. The construction quality And efficiency is not high, seriously affects the progress of construction. Contents of the invention [0003] The present invention provides a device and process for conveniently installing wallboards, improving construction efficiency, and the technical scheme for achieving the above-mentioned purpose is as follows: [0004] A plate installation device includes a profile, a groove is dug on the profile, and a plate is inserted into the groove of the profile. [0005] Optionally, the cross section of the groove is U-s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F13/072E04F13/23E04G21/14
CPCE04F13/072E04F13/0808E04G21/14
Inventor 高海明
Owner 普丽美家科技(北京)有限公司
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