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A two-dimensional thermal acoustic vector sensor chip and its implementation method

An acoustic vector sensor and chip technology, applied in instruments, measuring devices, measuring ultrasonic/sonic/infrasonic waves, etc., can solve problems such as large self-noise, poor high-frequency characteristics, and inability to guarantee the flow field at the same time, and achieve the effect of eliminating distortion

Active Publication Date: 2022-05-20
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] By assembling two one-dimensional sensors into one two-dimensional sensor, due to the existence of assembly errors, it is difficult to ensure that the two sensitive directions are completely orthogonal
[0006] Integrating two one-dimensional sensors on one chip, due to the existence of the substrate and leads, will block the incoming flow in a certain direction and change the direction of the incoming flow. It is impossible to guarantee that the flow field in two dimensions will not be distorted at the same time. Cause the sensitive axis to deviate
[0007] Under the condition that the flow field is not distorted, limited by the process conditions, the current two-dimensional chip structure can only integrate two hot wires, and the self-noise is relatively large
Moreover, the distance between the hot wires cannot be adjusted, and the high-frequency characteristics are poor.

Method used

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  • A two-dimensional thermal acoustic vector sensor chip and its implementation method
  • A two-dimensional thermal acoustic vector sensor chip and its implementation method
  • A two-dimensional thermal acoustic vector sensor chip and its implementation method

Examples

Experimental program
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Effect test

Embodiment 1

[0053] This embodiment adopts a bracket type, each group of support frames includes a support frame, and the form of the support frame adopts an inner penetrating hollow structure surrounded by four frames; the thermal acoustic vector sensor adopts a three-wire thermal acoustic vector sensor.

[0054] like figure 1 As shown, the two-dimensional thermal acoustic vector sensor chip of this embodiment includes: a substrate 1, a vertical support frame 21, a horizontal support frame 22, a horizontal flow channel 32, a vertical flow channel 31, a thermal acoustic vector sensor 4 and Electrode 5; wherein, two sets of mutually perpendicular support frames are arranged on the edge of the substrate 1, and the two sets include a support frame, and the two support frames are perpendicular to each other, respectively, a vertical support frame 21 and a horizontal support frame 22, and the vertical support frame 21 and the horizontal support frame 22 are both hollow internally, and the shape...

Embodiment 2

[0056] This embodiment of the present embodiment adopts a bracket type, each group of support frames includes two support frames, and the central axes of the two support frames in each group are located on the same straight line, so that two single shafts are integrated in the direction of one flow channel The thermal acoustic vector sensor ensures that the acoustic centers 7 of the two sensitive axes are at the same point, and the others are the same as the first embodiment.

Embodiment 3

[0058] This embodiment adopts a hollow type, each group of vertical flow channels 31 includes a vertical flow channel 31, and each group of horizontal flow channels 32 includes a horizontal flow channel 32; the hollow type form is formed by penetrating the center of the substrate 1 to form The interior is hollow and has an edged form.

[0059] like image 3 As shown, the two-dimensional thermal acoustic vector sensor 4 chip in this embodiment includes: a substrate 1, a horizontal flow channel 32, a vertical flow channel 31, a thermal acoustic vector sensor 4 and electrodes; Hollowing treatment is performed to form two sets of vertical flow channels 31 and horizontal flow channels 32 that are perpendicular to each other, each group includes a vertical flow channel 31 or a horizontal flow channel 32, and the vertical flow channel 31, that is, the direction of the flow channel is vertical The direction of the horizontal flow channel 32, that is, the direction of the flow channel...

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Abstract

The invention discloses a two-dimensional thermal acoustic vector sensor chip and a realization method thereof. In the present invention, flow channels with orthogonal directions are formed on the edge or center of the substrate, and the sensitive direction of the uniaxial thermal acoustic vector sensor arranged on the flow channel is parallel to the flow channel where it is located, and two or four uniaxial thermal acoustic vector sensors can be integrated. The acoustic vector sensor obtains two completely orthogonal vibration velocity components, and ensures that the performance of the two sensitive axes is consistent with that of a single thermal acoustic vector sensor, thus according to the two fully orthogonal horizontal vibration velocity components and vertical vibration velocity components Obtain the transmission direction of the sound wave; the present invention can ensure that there is no obstruction of the substrate in the vibration range of the acoustic particles in the flow channel, eliminate the distortion caused by the substrate to the flow field, and prevent the two sensitive axes from shifting; the present invention can Two single-axis acoustic vector sensors are integrated in the direction of the flow channel to ensure that the acoustic centers of the two sensitive axes are at the same point.

Description

technical field [0001] The invention relates to a microelectronic mechanical sensing technology, in particular to a two-dimensional thermal acoustic vector sensor chip and a realization method thereof. Background technique [0002] The sound vector sensor can detect the propagation direction of sound waves, and has a wide range of applications in the fields of sound source localization, underwater acoustic communication, and sound intensity measurement. Compared with the traditional sound pressure gradient vector sensor, the thermal sound vector sensor can directly measure the vibration velocity of acoustic particles, and has the advantages of small size, wide frequency band and high precision. The two-dimensional sound vector sensor can detect two orthogonal sound particle vibration velocity components, so a single sensor can realize sound source localization. [0003] The thermal acoustic vector sensor includes a heating beam and a temperature measuring beam. The heating ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01H17/00
CPCG01H17/00
Inventor 杨振川朱哲政杨凌濛高成臣郝一龙
Owner PEKING UNIV
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