High-performance computer cooling system

Abstract

The invention discloses a high-performance computer cooling system, belonging to the technical field of computers. The high-performance computer cooling system is characterized in that the high-performance computer cooling system comprises a case divided into an upper cavity, a middle cavity and a lower cavity, wherein the upper cavity is internally provided with a heat conduction piece attached to a processor on a mainboard for heat conduction, and the heat conduction piece is internally provided with a main heat exchange cavity; a cooling box is arranged in the middle cavity, a liquid storage tank is arranged in the cooling box, the liquid storage tank and the main heat exchange cavity are connected through two main heat guide pipes, and circulating pumping is achieved through a first pumping device; and the interior of the main heat exchange cavity is divided into two cavities through a main partition plate with a first notch, the two cavities of the main heat exchange cavity are both connected with a main heat exchange pipe, one end of the main heat exchange pipe extends into the main heat exchange cavity, and the other end of the main heat exchange pipe is connected with a first liquid inlet pipe and a first liquid outlet pipe through a second connector and a first connector respectively. The high-performance computer cooling system has good heat conduction and heat dissipation effects, and the stability and reliability of data processing of a high-performance computer are improved.

Description

technical field [0001] The invention relates to the field of computer technology, more specifically, it relates to a high-performance computer cooling system. Background technique [0002] The computer's processor and other components will generate heat during high-speed operation, especially its central processing unit, which has a large number of integrated circuit structures inside. With the operation of the computer, a large amount of heat will be generated, and due to its integration, a large number of The heat will gather locally, causing the temperature to rise sharply, and the high temperature will affect the normal work of the central processing unit, greatly reducing the computing speed, affecting the running stability of the computer, and even causing problems such as freezes and crashes in computing. The radiator can dissipate heat to a certain extent, but for some long-term and high-intensity transport situations, it will affect the cooling effect of the compute...

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Problems solved by technology

[0002] The computer's processor and other components will generate heat during high-speed operation, especially its central processing unit, which has a large number of integrated circuit structures inside. With the operation of the computer, a large amount of heat will be generated, and due to its integration, a large number of The heat will gather locally, causing the temperature to rise sharply, and the high temperature will affect the normal work of the central processing unit, greatly reducing the computing speed, affecting the running stability of the computer, and even causing problems such as freezes and crashes in computing. The radiator can dissipate heat to a certain extent, but for some cases of long-term and high-intensity transportation, it will affect the cooling effect of the computer

[0003] Especially for some domestic central processors, the heating situation is even more serious. Since my country's chip technology is still in a relatively backward stage, and continues to be blocked by related foreign technologies, it may further restrict the technical restrictions of chip-related industries in the future. Therefore, Some enterprises in our country have begun to gradually develop high-performance processors. However, due to the gap in technology, although the computing performance of the processor has been forcibly improved, its efficiency and heat generation control cannot be compared with some enterprises with mature technologies, so its overheating is more limited. Unable to control the temperature of the processor within a reasonable range, resulting in greatly increased instability caused by its overheating

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