Check patentability & draft patents in minutes with Patsnap Eureka AI!

Masking film for protecting sensitive substrates

A technology of masking film and adhesive layer, which is applied in the field of masking film and can solve problems such as expensive

Pending Publication Date: 2021-07-30
卓德嘉表层保护有限责任公司
View PDF15 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Binder-coated oriented polyester films can provide acceptable masking properties for such applications, but are also relatively expensive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Masking film for protecting sensitive substrates
  • Masking film for protecting sensitive substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Example 1 is a three layer masking film according to one embodiment of the present invention. The three-layer masking film has an adhesive layer made of a blend of about 55 wt % hydrogenated styrene block copolymer (SEBS), about 30 wt % HDPE and about 15 wt % LDPE, about 55 wt % HDPE A core layer made of a blend of about 45 wt% LDPE, and a release layer made of a blend of about 99 wt% LDPE and about 1 wt% antioxidant-containing masterbatch. The thickness of the adhesive layer was about 4.2 μm, the thickness of the core layer was about 21.0 μm, and the thickness of the release layer was about 2.8 μm.

Embodiment 2

[0051] Example 2 is a three layer masking film according to one embodiment of the invention. The three-layer masking film has an adhesive layer made of a blend of about 60 wt % hydrogenated styrene block copolymer (SEBS), about 25 wt % LDPE and about 15 wt % HDPE, about 60 wt % HDPE A core layer made of a blend of about 40 wt% LDPE, and a release layer made of a blend of about 60 wt% HDPE and about 40 wt% LDPE. The thickness of the adhesive layer was about 7.5 μm, the thickness of the core layer was about 18.0 μm, and the thickness of the release layer was about 4.5 μm.

Embodiment 3

[0052] Example 3 is a three layer masking film according to one embodiment of the invention. The three-layer masking film has an adhesive layer made of a blend of about 55 wt % hydrogenated styrene block copolymer (SEBS), about 30 wt % LDPE and about 15 wt % HDPE, about 55 wt % HDPE A core layer made of a blend of about 45 wt% LDPE, and a release layer made of a blend of about 99 wt% LDPE and about 1 wt% antioxidant-containing masterbatch. The thickness of the adhesive layer was about 10.0 μm, the thickness of the core layer was about 35.0 μm, and the thickness of the release layer was about 5.0 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 micrometers and 150 micrometers. The masking film also includes a release layer at a side of the adhesion layer opposite the outer adhesion surface.

Description

[0001] Cross-Referenced Related Applications [0002] This application claims the benefit of priority to U.S. Provisional Patent Application 62 / 781,253, filed December 18, 2018, which is incorporated herein by reference in its entirety. technical field [0003] The present invention generally relates to a masking film for protecting sensitive substrates. Background technique [0004] Masking films, also known as surface protection films, are commonly used to provide a physical barrier against damage, contamination, scratching, abrasion and / or other damage to the substrates to which they are adhered. Masking films can be applied to delicate, sensitive substrates used as components of electronic displays and protect the substrate during one or more subsequent processing steps during manufacturing as well as during shipping and / or storage prior to use of the substrate. [0005] The commonly used masking film achieves adhesion to the substrate through van der Waals force, which...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B27/00C09J7/40B32B27/32B32B7/06B32B27/08B32B27/30G02B30/25C09J7/20C09J7/24C09J7/38
CPCC09J7/10C09J7/381C09J2203/31C09J2423/106C09J2423/046C09J2423/04C09J2453/00C09J2301/122B32B2307/748B32B27/308B32B27/306B32B27/34B32B2307/732B32B27/327B32B27/302B32B27/325B32B2307/538B32B7/06B32B2571/00B32B2250/03B32B27/08B32B2250/24B32B27/32C09J2301/312C09J2301/302C09J7/201C09J7/243C09J7/383C09J7/387C09J7/401C08L23/06C09J2301/414C09J2423/045B32B2250/246B32B2405/00
Inventor G·K·琼斯B·B·戴塞C·D·雷S·帕克K·A·布拉迪
Owner 卓德嘉表层保护有限责任公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com