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Process method for filling closed cavity of temperature sensor with glue

A technology of temperature sensor and process method, which is applied to the device, coating and other directions of coating liquid on the surface, can solve the problems of non-opening of glue material, unstable glue filling, glue filling and punching line, etc., and achieve the realization of glue contamination. , Avoid glue splash, reduce the effect of impact

Pending Publication Date: 2021-08-06
HUATIAN TECH XIAN
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a process method for filling glue in a closed cavity, which solves the problem of unstable glue filling in the glue filling operation of temperature sensing products, and avoids the problem of glue filling in the existing technology. Process defects such as glue not spreading, glue splashing (contamination of substrate and PAD), glue filling and punching line, insufficient glue filling

Method used

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  • Process method for filling closed cavity of temperature sensor with glue

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Embodiment Construction

[0023] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0024] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate ...

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Abstract

The invention discloses a process method for filling a closed cavity of a temperature sensor with glue, and belongs to the technical field of glue dispensing. The process method includes the following steps that (1), on the basis of a dispensing process, a closed cavity substrate containing a glue inlet hole and an exhaust hole and a glue filling needle head are oppositely assembled; (2), the glue filling needle head enters the glue inlet hole, the glue filling needle head and the inner surface of the closed cavity substrate can reach the glue dispensing height, and the closed cavity is filled with the glue in a pneumatic glue discharging manner; and (3), after glue filling is finished, the glue filling needle head is lifted and then stays, and glue filling in the closed cavity of the temperature sensor is completed. According to the process method for filling the closed cavity of the temperature sensor with the glue, the problem that glue filling is not stable in the glue filling operation of temperature sensing products is solved, and the process defects that in the prior art, glue cannot be diffused, glue splashes, lines are punched during glue filling, and glue filling is not full are overcome.

Description

technical field [0001] The invention belongs to the technical field of glue dispensing, and relates to a process method for filling glue in a sealed cavity of a temperature sensor. Background technique [0002] For temperature sensing products, it is required to have high heat conduction efficiency between the chip and the shell. It is necessary to connect the shell and the surface of the chip with high heat conduction glue to form a heat conductor, that is, to fill the sealed cavity with glue after the cover is pasted. At present, the commonly used glue filling technology is to use Underfill equipment to fill the closed cavity with glue, but this method often has abnormalities and cannot work stably, the glue overflows, the glue fills the line, and the glue will contaminate the PAD, so the product cannot The impact of sample preparation and mass production schedule. Contents of the invention [0003] In order to overcome the above-mentioned shortcomings of the prior art,...

Claims

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Application Information

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IPC IPC(8): B05D1/26
CPCB05D1/26
Inventor 张路路
Owner HUATIAN TECH XIAN
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