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Full-automatic plate packing device

A fully automatic, sheet-like technology that can be used in packaging, transportation and packaging, packing/bundling items, etc., to solve problems such as bending and overlapping, insufficient sheet packing, etc.

Active Publication Date: 2021-08-06
北新建材(天津)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a fully automatic packing device for boards, so as to solve the problem of bending and overlapping of packing films in the prior art, which leads to insufficient packing of boards technical issues

Method used

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Embodiment Construction

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0054] Such as figure 1 As shown, the present invention provides a fully automatic packaging device for plates, including a transport mechanism 2 for transporting plates, one end of the transport mechanism 2 is connected to a stacking mechanism for putting stacked multi-layer plates towards the transport mechanism 2 1. The other end of the transport mechanism 2 is connected to an automatic packing mechanism 9 for receiving the plates delivered by the transport...

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Abstract

The invention discloses a full-automatic plate packaging device. The device comprises a conveying mechanism used for conveying plates, wherein one end of the conveying mechanism is connected to a stack discharging mechanism used for putting multiple layers of stacked plates towards the conveying mechanism, the other end of the conveying mechanism is connected to an automatic packaging mechanism used for receiving the plates conveyed by the conveying mechanism and packaging the plates. According to the device, through a plate correcting mechanism and a packaging and shaping mechanism, flattening and fixing operation is conducted on packaging films and the plates in the packaging process, and in the specific implementation process, the plate correcting mechanism is used for correcting positions of the received plates, and fixing the plates, so that the low efficiency caused by bending and overlapping during follow-up packaging of the packaging films is prevented, then the packaging and shaping mechanism can slide along the outer side walls of the multiple layers of plates to achieve the action of winding the packaging films on the outer sides of the multiple layers of plates, and in the packaging film winding process, the packaging and shaping mechanism can flatten and position the packaging films.

Description

technical field [0001] The invention relates to the technical field of board packaging, in particular to a board automatic packaging device. Background technique [0002] After the production is completed, the boards need to be packaged with stretch film to improve the waterproof, moisture-proof and dust-proof effect of the boards during storage or transportation in the warehouse. When the boards are shipped off the assembly line, they need to be stacked together. Then pack it, and at this time, you need to use a fully automatic packing device. [0003] Most of the current packaging devices are manually packaged or machine-automatically packaged, but they have limitations when facing the bending and folding of the packaging film during packaging. For example, when using a fully automatic packaging device to pack multi-layer boards At the same time, if the position of the plate is shifted, the packaging film will not be able to cling to the plate at the first time during the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B35/56B65B11/02
CPCB65B35/56B65B11/02
Inventor 文子滕
Owner 北新建材(天津)有限公司
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