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Chip packaging method and chip packaging structure

A chip packaging structure and chip packaging technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as damage to the packaging structure

Pending Publication Date: 2021-08-10
SHANGHAI AWINIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the purpose of this application is to provide a chip packaging method and a chip packaging structure, which can solve the problem of damage to the packaging structure during the chip packaging process

Method used

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  • Chip packaging method and chip packaging structure
  • Chip packaging method and chip packaging structure
  • Chip packaging method and chip packaging structure

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Embodiment Construction

[0047] In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings.

[0048] In the following description, a lot of specific details are set forth in order to fully understand the application, but the application can also be implemented in other ways different from those described here, and those skilled in the art can do it without violating the content of the application. By analogy, the present application is therefore not limited by the specific embodiments disclosed below.

[0049] Secondly, the present application is described in detail in combination with schematic diagrams. When describing the embodiments of the present application in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged...

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Abstract

The embodiment of the invention provides a chip packaging method and a chip packaging structure. The method comprises the steps of providing a substrate, wherein the substrate comprises a first surface and a second surface which are opposite to each other, the second surface of the substrate is provided with a plurality of bottom bonding pads, the interior of the substrate is provided with interconnection lines, and the surfaces of the bottom bonding pads are covered with an organic film layer; arranging a chip on the first surface of the substrate; and electrically connecting the chip and the bottom bonding pads through the interconnection lines. Therefore, according to the chip packaging method provided by the embodiment of the invention, the surfaces of the bottom bonding pads are covered with the organic film layer, so that the bottom bonding pads can be protected from being damaged in the packaging process, and the problem that the packaging structure is damaged due to the fact that the bottom bonding pads are damaged is avoided.

Description

technical field [0001] The present application relates to the technical field of semiconductors, and more specifically, to a chip packaging method and a chip packaging structure. Background technique [0002] With the continuous upgrading of consumer electronics technology in the market, electronic devices such as mobile phones, smart wearable devices and tablet computers have higher and higher requirements for the reliability of chip (Integrated Circuit Chip) packaging. [0003] Existing packaging structures mainly include Land Grid Array Package (LGA) and Ball Grid Array Package (BGA). The problem of damage occurs, resulting in a decrease in the yield rate of chip packaging and an increase in cost. [0004] Therefore, there is a problem in the prior art that the packaging structure is damaged during the chip packaging process, resulting in increased costs. Contents of the invention [0005] In view of this, the purpose of the present application is to provide a chip pa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L21/60H01L23/498H01L23/31
CPCH01L21/50H01L21/56H01L23/3107H01L23/49838H01L23/49894H01L24/80H01L2224/16225H01L2924/15311H01L2924/181H01L2924/00012
Inventor 姜域周进殷昌荣
Owner SHANGHAI AWINIC TECH CO LTD