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Substrate processing device, furnace opening/closing unit, and method for manufacturing semiconductor device

A substrate processing device and a closed unit technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, gaseous chemical plating, etc., can solve the problems of particle generation and position change that cannot be completely dealt with, and achieve the effect of suppressing particle generation

Pending Publication Date: 2021-08-13
KOKUSA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the conventional positioning mechanism has a structure in which the base slides up and down with respect to the cylinder provided at the center of the cover, and it may not be able to fully cope with positional changes due to thermal expansion.
Therefore, there is a possibility that parts may rub against each other during sliding during the closing operation, and particles may be generated.

Method used

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  • Substrate processing device, furnace opening/closing unit, and method for manufacturing semiconductor device
  • Substrate processing device, furnace opening/closing unit, and method for manufacturing semiconductor device
  • Substrate processing device, furnace opening/closing unit, and method for manufacturing semiconductor device

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Embodiment Construction

[0019] Embodiments of the present disclosure are described with reference to the drawings. Figure 1 ~ Figure 3 A vertical substrate processing apparatus is shown as an example of the substrate processing apparatus. In addition, the wafer 17 which consists of silicon etc. is shown as an example of the board|substrate processed by this board|substrate processing apparatus.

[0020] The substrate processing apparatus 1 includes a housing 2 , and a front maintenance port 4 serving as an opening provided to allow maintenance is interposed between a lower portion of a front wall 3 of the housing 2 . The front maintenance port 4 is opened and closed by a front maintenance door 5 .

[0021] On the front wall 3 of the box body 2 , a transfer box loading and unloading port 6 is interposed so as to communicate with the inside and outside of the box body 2 . The transport box import and export port 6 is opened and closed by a front shutter (not shown), and a loading port 7 is provided ...

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PUM

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Abstract

This configuration is provided with: a reaction chamber for processing substrates; a lid body that closes a furnace opening of the reaction chamber; a base that is attached below the lid body; and a connecting member that is provided so as to interconnect the lid body and the base. The connecting member is configured to have: a shaft part that is attached to the lid body; an elastic member that is provided so as to surround the shaft part and that holds the lid body; a cap that is provided so as to surround the elastic member and that is attached to the base; a fixing block that is attached below the cap; and a moving block that is held by a holding member provided between the fixing block and the shaft part.

Description

technical field [0001] The present disclosure relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer, a furnace mouth sealing unit, and a method of manufacturing a semiconductor device. Background technique [0002] As a substrate processing apparatus that performs substrate processing in a manufacturing process of a semiconductor device, there is a vertical substrate processing apparatus. In the conventional vertical substrate processing apparatus, there is a possibility that the arm portion provided in the moving mechanism may be bent due to the weight of the substrate holder or the like, the thrust of the moving mechanism when the reaction chamber is hermetically sealed, and the like. Conventionally, there is a mechanism capable of maintaining the airtightness inside the reaction chamber even when the arm is bent and the parallelism between the opening of the reaction chamber, the arm, and the susceptor collapses. [0003] Fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/31C23C16/44
CPCC23C16/44H01L21/31H01L21/67757H01L21/67769H01L21/67126H01L21/6719C23C16/4583H01L21/67303H01L21/68H01L21/67098
Inventor 野上孝志山岛规裕
Owner KOKUSA ELECTRIC CO LTD