Millimeter wave dielectric resonator antenna module and communication equipment

A dielectric resonator and antenna module technology, which is applied in the direction of antenna, antenna grounding device, antenna grounding switch structure connection, etc., can solve the problem of increased processing difficulty, difficulty in realizing millimeter-wave antenna modules covering multiple frequency bands at the same time, PCB thickness Increase and other issues to achieve the effect of improving frequency band coverage

Pending Publication Date: 2021-08-17
SHENZHEN SUNWAY COMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for PCB-based conventional mmWave broadband antennas, no matter the antenna form is a patch antenna (patchantenna), a dipole antenna (dipole antenna) or a slot antenna (slot antenna), the thickness of the PCB will increase as the bandwidth to be covered increases. increase, resulting in an increase in the size of the antenna module
For antenna PCBs used in the millimeter wave band, as the number of PCB layers increases, the accuracy requirements for holes, line widths, and line spacings of multilayer PCBs will increase, resulting in increased processing difficulty and difficult to realize millimeter wave antenna modules. Simultaneous coverage of multiple frequency bands

Method used

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  • Millimeter wave dielectric resonator antenna module and communication equipment
  • Millimeter wave dielectric resonator antenna module and communication equipment
  • Millimeter wave dielectric resonator antenna module and communication equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0053] Please refer to Figure 1-4 , a millimeter-wave dielectric resonator antenna module in this embodiment, including a dielectric resonator module 1, a dielectric layer 2 and a metal ground 3;

[0054]The dielectric resonator module 1 is a ceramic body structure and is located on one side of the dielectric layer 2;

[0055] The metal ground 3 is located on the side of the dielectric layer 2 away from the dielectric resonator module 1;

[0056] The metal ground 3 is provided with a grid structure 4 corresponding to the dielectric resonator module 1;

[0057] Among them, the dielectric resonator module 1 with a ceramic body structure is small in size, and its processing cost and raw material cost are lower than that of PCB antennas, and the processing accuracy of multi-layer PCB antennas is avoided;

[0058] Specifically, such as figure 2 As shown, also includes a reflector 5;

[0059] The reflector 5 is located on the side of the metal ground 3 away from the dielectric...

Embodiment 2

[0076] Please refer to Figure 1-2 , 5. The difference between this embodiment and the first embodiment is that the specific structure of the dielectric resonator module and the grid is limited:

[0077] Such as figure 1 As shown, the dielectric resonator module 1 includes a plurality of dielectric resonator units;

[0078] Preferably, the number of the dielectric resonator units is 4;

[0079] The dielectric resonator units are arranged in a straight line at equal intervals on the one side of the dielectric layer 2;

[0080] The metal ground 3 is provided with a grid structure 4 corresponding to the dielectric resonator unit;

[0081] Specifically, such as figure 2 As shown, the number of the grid structure 4 and the number of the dielectric resonator units correspond to 4, and the dielectric resonator units correspond to the grid structure 4 one-to-one;

[0082] Wherein, the direction of the grid structure 4 is perpendicular to the arrangement direction of the pluralit...

Embodiment 3

[0088] A communication device includes the millimeter-wave dielectric resonator antenna module described in Embodiment 1 or Embodiment 2.

[0089] In summary, the present invention provides a millimeter-wave dielectric resonator antenna module and communication equipment, including a dielectric resonator module, a dielectric layer, and a metal ground. The dielectric resonator module is a ceramic body structure, and is located on One side of the dielectric layer, the metal ground is located on the side of the dielectric layer away from the dielectric resonator module, the dielectric resonator module includes a plurality of dielectric resonator units, and the dielectric resonator unit Arranged in a straight line at equal intervals on the one side of the dielectric layer, and the metal ground is provided with a grid structure corresponding to the dielectric resonator unit, and also includes a reflection plate, the reflection plate is located on the metal ground The side away from...

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Abstract

The invention discloses a millimeter wave dielectric resonator antenna module and communication equipment. The antenna module comprises a dielectric resonator module, a dielectric layer and a metal ground; the dielectric resonator module is of a ceramic body structure and is located on one side of the dielectric layer. The metal ground is positioned on one side, far away from the dielectric resonator module, of the dielectric layer; the metal ground is provided with a grid structure corresponding to the dielectric resonator module, the dielectric resonator module is made of a ceramic body structure, and the metal ground is provided with the grid structure corresponding to the dielectric resonator module, so a feed form can be changed to excite various dielectric resonator antenna modes, and the TEnmp modes and the TMnmp modes can be excited at the same time; moreover, the resonance generated by the modes is generally adjacent, and a broadband can be formed, so the antenna module can cover n257, n258 and n261 frequency bands, an ultra-wideband antenna is finally formed, and the frequency band coverage rate of the antenna module is increased.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a millimeter-wave dielectric resonator antenna module and communication equipment. Background technique [0002] 5G (5th-Generation, fifth-generation mobile communication technology) is the research and development focus of the global industry. It has become an industry consensus to develop 5G technology and formulate 5G standards. At the 22nd meeting of ITU-RWP5D held in June 2015, the International Telecommunication Union ITU clarified three main application scenarios of 5G: enhanced mobile broadband, large-scale machine communication, and high-reliability and low-latency communication. These three application scenarios correspond to different key indicators. Among them, the peak user speed in the enhanced mobile bandwidth scenario is 20Gbps, and the minimum user experience rate is 100Mbps. [0003] Since the millimeter wave has high carrier frequency and large bandwidth char...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/36H01Q1/48H01Q1/50H01Q5/10H01Q5/28H01Q5/314H01Q19/10
CPCH01Q1/36H01Q1/48H01Q1/50H01Q19/104H01Q5/10H01Q5/28H01Q5/314
Inventor 赵伟侯张聚唐小兰戴令亮谢昱乾
Owner SHENZHEN SUNWAY COMM
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