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A Blind Insertion Structure of Vertical Interconnection between Boards and Its Realization Method

An implementation method and blind-mating technology, which are applied in the directions of printed circuits, printed circuits, and electrical components connected with non-printed electrical components, can solve the problem of high production costs, inability to use multiple connectors, and multi-layer blind-mating connections and structures. complex and other problems, to achieve the effect of reducing external stress and high reliability of vertical interconnection

Active Publication Date: 2022-05-17
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Chinese patent with the publication number CN108598770B introduces a reliable blind-mating electrical connector and a blind-mating method. The device includes a plug and a socket, which is suitable for blind-mating between a single pair of connectors, and cannot be used for multiple connectors and multiple connectors. Level Blind Mate Connection
The Chinese patent with the publication number CN110561080B introduces a high-density component multi-level blind-mating intelligent assembly device and blind-mating method, which can automatically detect the position and depth of the connector blind receptacle position. The device includes a three-dimensional servo motion platform, precision optical The platform, TR component grabbing unit, laser scanning unit, etc. have very complex structures and high production costs, and are not suitable for small-batch production

Method used

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  • A Blind Insertion Structure of Vertical Interconnection between Boards and Its Realization Method
  • A Blind Insertion Structure of Vertical Interconnection between Boards and Its Realization Method
  • A Blind Insertion Structure of Vertical Interconnection between Boards and Its Realization Method

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Embodiment

[0046] This embodiment provides a blind insertion structure for vertical interconnection between boards, such as Figure 9 As shown, the structure includes a mounting plate 1, a backing plate, a printed board assembly, a pressure plate, a mounting plate 2 and a spacer.

[0047] Among them, such as figure 2 As shown, there is a concave cavity on the mounting board 1, and the backing plate, the printed board assembly and the pressure plate are sequentially put into the concave cavity for positioning and assembly. The bottom of the cavity is equipped with an SMPM-M connector. There are two positioning pins at the bottom of the cavity. At the same time, pin holes are designed on the corresponding positions of the backing plate, printed board and pressure plate. The gap between the positioning pins and the pin holes is 0.02. -0.05mm, the chamfer of the pinhole opening is 0.3mm×45°; the left and right edges of the mounting plate 1 are also provided with positioning holes.

[0048...

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Abstract

The invention relates to the field of electronic equipment, and discloses a blind insertion structure for vertical interconnection between boards and a realization method thereof. The structure includes: a first mounting board, a backing board, a printed board assembly, a pressing board, and a second mounting board; The mounting plate has a cavity, and the SMPM‑M connector is installed at the bottom of the cavity, and the backing plate, printed board assembly, and pressure plate are assembled in the cavity in sequence; the front and back of the printed board assembly are equipped with surface mount connectors; And the SMT connectors on both sides of the front and back are crimped with KK heads; the position of the backing plate corresponding to the SMT connector on the front of the printed board assembly is provided with a stepped structural through hole; the pressure plate corresponds to the surface mount connection on the back of the printed board assembly The position of the connector is provided with a stepped structure through hole; the second mounting plate is equipped with a JSSMP radio frequency coaxial connector, and the second mounting plate is assembled on the first mounting plate. The blind mating structure can realize fast, reliable and high-precision vertical interconnection between boards.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to the field of electric interconnection of printed board components, array antennas and front ends, and in particular to a blind insertion structure of vertical interconnection between boards and an implementation method thereof. Background technique [0002] Low-frequency and high-frequency signal transmission between printed board components is generally connected through cable components, through-hole plug-in connectors or insulators. However, as the number of vertically interconnected signals between printed board components increases, the traditional vertically interconnected structure has problems such as large volume, complicated assembly, and high cost. In this case, the structure of using SMPM RF coaxial connectors for blind insertion to realize vertical interconnection between boards came into being. [0003] The surface mount SMT-SMPM-JE RF coaxial connector based on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/30H05K3/34
CPCH05K1/181H05K3/30H05K3/34
Inventor 曹洪志黄福清张涛王宇张义萍张怡张宇
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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