Miniature electronic component welding device and a maintenance method thereof

Abstract

The invention discloses a miniature electronic component welding device and a maintenance method thereof. The miniature electronic component welding device comprises a circuit backboard and a middle communication structure; a plurality of electrode contact pad groups are arranged on the front surface of the circuit backboard in an array manner; the middle communication structure is arranged on the front surface and covers the electrode contact pad group; the middle communication structure is used for movably arranging the micro electronic element, and when the micro electronic element is arranged on the middle communication structure and a test signal is applied to the circuit backboard, the electrode of the micro electronic element is correspondingly contacted with the electrode contact pad in the electrode contact pad group for conduction. By determining whether contact conduction occurs or not, whether the miniature electronic element has a fault or not can be detected, if the miniature electronic element has the fault, the faulted miniature electronic element can be pulled out, a healthy miniature electronic element is replaced, whether the miniature electronic element is a defective pixel element or not can be detected under the condition that welding and fixing are not conducted, and timely replacement of the miniature electronic element is achieved; and meanwhile, the situation that the welding capacity is gradually lost due to the fact that the welding flux is repeatedly heated in a traditional overhauling method is avoided.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a miniature electronic component welding device and a maintenance method thereof. Background technique [0002] With the advancement of semiconductor and integrated circuit technology, the size of electronic components such as diodes, transistors, sensors, and actuators is getting smaller and smaller, even reaching the level of less than 100 microns. When using these microelectronic components to manufacture electronic equipment, it is necessary to solder these microelectronic components to corresponding positions on the circuit board one by one. In addition, affected by the yield rate of the microelectronic components, the microelectronic components soldered on the circuit board may be defective electronic components. [0003] After detecting a dead point microelectronic component, it is generally necessary to heat the solder of the dead point electronic component to ...

AI Technical Summary

Problems solved by technology

In addition, affected by the yield rate of microelectronic components, the microelectronic components soldered on the circuit board may be defective electronic components.

Images