Hot pressing device for printed circuit board processing and processing technology
A technology for printed circuit boards and hot pressing devices, applied in the directions of printed circuits, printed circuit manufacturing, multilayer circuit manufacturing, etc., can solve the problems of high temperature of multilayer boards, influence of processing environment, burns, etc. The effect of PCB board damage and efficiency improvement
Active Publication Date: 2021-08-24
恩达电路(深圳)有限公司
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Problems solved by technology
[0006] Aiming at the deficiencies of the prior art, the present invention provides a hot pressing device for processing printed circuit boards, which has the advantages of rapid heat dissipation, automatic discharge, and purification of toxic gases, and solves the problem that a large amount of toxic gases have a greater impact on the processing environment At the same time, the temperature of the multi-layer board formed after hot pressing is relatively high, and it is easy to cause burns when taking it out
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0034] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a heat press device for processing printed circuit boards.
[0035] see Figure 1-6, a heat press device for processing printed circuit boards, comprising a base 1, a T-shaped frame 2 is fixedly connected to one side of the upper surface of the base 1, and a frame 3 is fixedly connected to ...
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The invention relates to the technical field of printed circuit board processing, and discloses a hot pressing device for printed circuit board processing and a processing technology. The hot pressing device comprises a base, a T-shaped frame is fixedly connected to one side of the upper surface of the base, a rack is fixedly connected to one side of the upper surface of the T-shaped frame, and a motor is fixedly connected to the upper surface of the rack; a rotating shaft of the motor penetrates through the rack to be fixedly connected with a screw, and the screw penetrates through and is rotationally connected with the T-shaped frame. When an upper pressing box descends, a second screw sleeve descends synchronously, when the upper pressing box ascends, the second screw sleeve ascends synchronously to jack up a hot-pressing bottom plate, the automatic discharging effect is achieved, and the risk of high-temperature scalding during material taking is reduced; the proportional relation between the lifting height of the upper pressing box and the lifting height of the second screw sleeve is achieved through the modulus ratio and direction change of the first bevel gear, the second bevel gear, the third bevel gear and the fourth bevel gear, automatic linkage is achieved, the automation degree of the hot pressing device is improved, and the production efficiency is indirectly improved.
Description
technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a hot pressing device and processing technology for printed circuit board processing. Background technique [0002] The printed circuit board is also called the PCB board, and the electrical connection between the component pins is realized through the printed wires, solder pieces and metallized vias on the printed circuit board. Through a certain process, a layer of copper film with good conductivity is covered on a highly insulating substrate to form a material necessary for the production of printed circuit boards - copper clad laminates. According to the circuit requirements, the conductive pattern is etched on the copper clad laminate, and the mounting holes for the component pins, the via holes for electrical interconnection and the screw holes required for fixing the entire circuit board are drilled, and the printed circuit board required for elect...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 吕忠韩飞
Owner 恩达电路(深圳)有限公司