Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Phase change memory and method of making the same

A technology of phase-change memory and contact holes, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of low-quality film layers of phase-change memory, improve layout flexibility, increase quantity, The effect of improving the quality of the film layer

Active Publication Date: 2022-07-19
YANGTZE ADVANCED MEMORY INDUSTRIAL INNOVATION CENTER CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a phase change memory to solve the problem of low film quality of the existing phase change memory

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Phase change memory and method of making the same
  • Phase change memory and method of making the same
  • Phase change memory and method of making the same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0079] For the phase change memory as described above, the following combination Figure 4a The preparation method thereof will be described. like Figure 4a As shown, the preparation method of the phase change memory may specifically include: respectively forming an auxiliary bit line layer and an auxiliary word line layer in two planes parallel to each other. forming an auxiliary word line layer in a plane-parallel second plane; and etching the auxiliary word line layer and the auxiliary bit line layer to form a first contact hole; covering the isolation on the sidewall of the first contact hole layer, and a conductive material layer is filled in the first contact hole to form a first contact plug.

[0080] Based on the above preparation method, a first contact plug electrically insulated from the auxiliary bit line layer and the auxiliary word line layer can be formed in the peripheral region, and the auxiliary bit line layer and the auxiliary word line can also be formed...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a phase change memory and a preparation method thereof. The phase change memory includes a first contact plug penetrating through the auxiliary word line layer and the auxiliary bit line layer in sequence, and the outer sidewall of the first contact plug is provided with an isolation layer, so as to prevent the conductive material layer in the first contact plug from interacting with each other. Auxiliary word lines / auxiliary bit lines interfere with each other. In this way, it is beneficial to flexibly set auxiliary bit lines, auxiliary word lines and first contact plugs, prevent regions with too low pattern density in the corresponding bit line layers and word line layers, and help improve the prepared bit line layers. and the film quality of the word line layer, and can increase the number of first contact plugs. In addition, since the arrangement regions of the auxiliary bit lines, the auxiliary word lines and the first contact plugs can allow for spatial overlap, an effective reduction in device size can also be achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a phase change memory and a preparation method thereof. Background technique [0002] The rapid development of information technology requires a large number of high-performance storage devices. Low voltage, low power consumption, high speed and high density are the inevitable development trends of storage technology. Phase change memory PCM is a new generation of non-volatile solid-state semiconductor memory developed on the basis of CMOS integrated circuits. Compared with today's mainstream products, it has many advantages. For example, in terms of storage density, the current mainstream memory has a limit on the technology node of more than 20 nanometers, and cannot be further compactly integrated; while the phase change memory can reach the order of 5 nanometers. And, in terms of storage speed, the phase change resistance of the phase change memory is 100 times faster...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/528H01L21/768H01L27/24
CPCH01L23/528H01L21/76831H01L2221/1057H10B63/80
Inventor 张曙王晓娟雷威锋刘峻张恒
Owner YANGTZE ADVANCED MEMORY INDUSTRIAL INNOVATION CENTER CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products