Manual grinding and polishing microsection auxiliary set and auxiliary tool

Abstract

The invention relates to a manual grinding and polishing microsection auxiliary set and auxiliary tool. The auxiliary tool comprises a holding part and a clamping part which are connected in a matched mode, the clamping part is used for clamping and fixing a glue pouring sample so that the glue pouring sample can be fixed relative to the clamping part, and the holding part and / or the clamping part are / is provided with a position change detection device. The position change detection device is used for detecting and feeding back the position change of the auxiliary tool; during application, a glue filling sample is fixed to the clamping part, a user holds the holding part by hand to press the glue filling sample on the grinding and polishing machine for grinding and polishing, and the user can observe information fed back by the position change detection device in real time and adjust the information in time in the grinding and polishing process so that the position of the glue filling sample can be kept stable; according to the auxiliary tool, the holding part convenient for a user to hold is provided, the auxiliary tool is not easy to slip out of the hand during grinding and polishing, and the position change detection device can know the position change of a glue pouring sample in real time, so that the position change can be adjusted and reset in time, stable and consistent stress on a grinding and polishing surface is ensured, the problem of multiple surfaces after grinding and polishing is avoided, and subsequent observation and analysis are facilitated.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to an auxiliary set for manual grinding and polishing metallographic slicing and an auxiliary tool for manual grinding and polishing metallographic slicing. Background technique [0002] Electronic products often require metallographic sections in R&D, quality control, and failure analysis, such as measuring the thickness of the surface coating, observing whether there are solder joints, and confirming the state of the internal PCB. [0003] At present, the production of metallographic sections first needs to put the sample into the mold, and pour and solidify it with acrylic resin or epoxy resin to form a glued sample, and then hold the glued sample to grind and polish it on a grinding and polishing machine until the glued sample is exposed and needs to be observed However, the size of the glue-filled sample is usually small, it is not easy to hold, it is easy to take o...

AI Technical Summary

Problems solved by technology

[0003] At present, the production of metallographic sections first needs to put the sample into the mold, and pour and solidify it with acrylic resin or epoxy resin to form a glued sample, and then hold the glued sample to grind and polish it on a grinding and polishing machine until the glued sample is exposed and needs to be observed However, the size of the glue-filled sample is usually small, it is not easy to hold, it is easy to take off the hand, and it is easy to cause uneven friction on the grinding and polishing surface due to uneven force during grinding and polishing, and eventually multiple planes appear, which affects the follow-up observation and analysis

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