Check patentability & draft patents in minutes with Patsnap Eureka AI!

Double-station IC test sorting machine

A technology for testing sorting machines and double stations, applied in sorting and other directions, can solve the problem that sorting equipment cannot take into account low cost and high efficiency, so as to reduce control costs and equipment costs, and ensure sorting efficiency and low cost. with high efficiency

Active Publication Date: 2021-09-03
东莞市华越半导体技术股份有限公司
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a dual-station IC test and sorting machine to solve the problem that the current sorting equipment cannot take into account both low cost and high efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-station IC test sorting machine
  • Double-station IC test sorting machine
  • Double-station IC test sorting machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0059] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0060] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner" and "outer" are based on those shown in the accompanying drawings. Orientation or positional relationship is only for the convenience of describing ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a double-station IC test sorting machine. When IC chips are sorted, the pin position conditions of the two IC chips clamped on a dividing device are judged through a pin position detection device, and when the pin position detection device judges that the pin positions of the two IC chips are staggered, a steering motor drives a steering transmission assembly to drive two rotating tables to rotate by a preset angle at the same time, that is, the rotating tables rotate by 180 degrees to enable the IC chips to rotate by 180 degrees; and when the pin position detection device judges that the pin position of one of the IC chips is staggered, the steering motor drives the steering transmission assembly to drive the corresponding rotating table to rotate by a preset angle at the same time, namely, the rotating table rotates by 180 degrees to enable the IC chip to rotate by 180 degrees. Therefore, steering of the two IC chips can be achieved only by inputting and controlling one steering motor, the control cost and the equipment cost of the double-station IC test sorting machine are reduced, sorting of the double IC chips is achieved at the same time, the sorting efficiency is guaranteed, and low cost and high efficiency are both considered.

Description

technical field [0001] The invention relates to the technical field of IC chip sorting, in particular to a double-station IC testing and sorting machine. Background technique [0002] With the development of electronic products, consumer electronic products such as notebook computers, mobile phones, mini-CDs, palmtop computers, CPUs, and digital cameras are becoming more and more miniaturized. Among them, the IC chip (Integrated Circuit integrated circuit) as the core plays a key role. Among them, IC includes a sorting process in the finished product process, and the function of the sorting process is to screen out unqualified IC chips. [0003] In the prior art, the vibrating plate is mainly used to transport the IC chips to the sorting equipment. Although the vibrating plate can ensure that the first side of the IC chip faces upward and has a uniform orientation, it is easy for IC chips with symmetrically distributed pins. If there is a phenomenon that the pin distributio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B07C5/02B07C5/36
CPCB07C5/02B07C5/36
Inventor 谢国清曹国光曹皇东罗奕真
Owner 东莞市华越半导体技术股份有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com