Wafer cleaning device and wafer electroplating system comprising same
A technology for cleaning devices and wafers, applied to circuits, cleaning methods and utensils, cleaning methods using liquids, etc., can solve problems such as poor cleaning effect of wafers, and achieve favorable collection, improve cleaning effect, and prevent pollution. Effect
Pending Publication Date: 2021-09-03
硅密芯镀(海宁)半导体技术有限公司
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a wafer cleaning device and a wafer electroplating system including it in order to overcome the defect that the cleaning effect of the wafer is poor in the prior art
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Embodiment Construction
[0058] The present invention is further illustrated below by means of examples, but the present invention is not limited thereto within the scope of examples.
[0059] This embodiment provides a wafer electroplating system, which is used for performing electroplating processing on wafers, cleaning the wafers after the electroplating process, and removing the electroplating solution attached to the surface of the wafers. Such as Figure 1-Figure 6 As shown, the wafer electroplating system includes an operation table 11, an electroplating tank 12, a manipulator 13 and a wafer cleaning device.
[0060] The electroplating tank 12 is installed on the operating platform 11 , and the operating platform 11 plays a role in supporting the electroplating tank 12 . The electroplating tank 12 contains an electroplating solution, and the wafer is immersed in the electroplating solution in the electroplating tank 12 for electroplating processing. The manipulator 13 is arranged on the top o...
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The invention discloses a wafer cleaning device and a wafer electroplating system comprising the same. The wafer cleaning device comprises a liquid conveying part, a liquid containing disc and a first driving part, the liquid conveying part can contain liquid used for cleaning a wafer, a liquid conveying opening of the liquid conveying part is aligned with the surface of the wafer, and the liquid in the liquid conveying part can flow to the wafer from the liquid conveying opening. The liquid containing disc is arranged on the edge side of the wafer in a surrounding manner. The first driving part is connected with the horizontally-arranged wafer and can drive the wafer to rotate along the axis. According to the wafer cleaning device and the wafer electroplating system, waste water generated by wafer cleaning can be thrown into the liquid containing disc through rotation of the wafer, and therefore the wafer can be cleaned through the most pure liquid all the time, the wafer cannot be located in liquid mixed with electroplating liquid for a long time, secondary utilization of the waste water generated by wafer cleaning is effectively avoided, and the cleaning effect of the wafer is improved.
Description
technical field [0001] The invention relates to the field of semiconductor processing, in particular to a wafer cleaning device and a wafer electroplating system including the wafer cleaning device. Background technique [0002] During the wafer electroplating process, in order to ensure the electroplating quality, it is necessary to soak the entire wafer in the electroplating solution in the electroplating bath. After the electroplating is completed, there will be a large amount of electroplating solution on the surface of the wafer. It is necessary to clean the surface of the wafer with clean water to completely clean the electroplating solution attached to the surface of the wafer to ensure that it will not affect the subsequent use of the wafer. . [0003] In the prior art, a method for cleaning the electroplating solution attached to the surface of the wafer is to soak the wafer attached with the electroplating solution in a cleaning tank containing clean water for cle...
Claims
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Login to View More IPC IPC(8): C25D7/12C25D5/48B08B3/10
CPCC25D7/12C25D5/48B08B3/102
Inventor 史蒂文·贺·汪林鹏鹏
Owner 硅密芯镀(海宁)半导体技术有限公司