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Double-scale efficient localized electrochemical deposition printing pure copper structural part manufacturing device and method

A manufacturing device and dual-scale technology, applied in the field of dual-scale high-efficiency localized electrodeposition printing pure copper structural parts manufacturing device, can solve problems such as high time cost and the like

Active Publication Date: 2021-09-07
CHANGCHUN UNIV OF SCI & TECH
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Problems solved by technology

The usual printing speed is 10-20μm 3 / s LECD-μAM technology, to achieve 850μm size manufacturing has a high time cost for LECD-μAM technology

Method used

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  • Double-scale efficient localized electrochemical deposition printing pure copper structural part manufacturing device and method
  • Double-scale efficient localized electrochemical deposition printing pure copper structural part manufacturing device and method
  • Double-scale efficient localized electrochemical deposition printing pure copper structural part manufacturing device and method

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Embodiment Construction

[0034] Dual-scale high-efficiency localized electrodeposition printing pure copper structural parts manufacturing device, such as Figure 1 ~ Figure 3 As shown, it includes vibration isolation platform 1, EcP printing system 2, EDM electric discharge machining system 3, LECD-μAM system 4, electrolytic cell unit 5, electrolytic cell motion unit 6, EcP printing motion system 7 and central control system 8,

[0035] The vibration isolation platform 1 is used as the basis of the dual-scale high-efficiency localized electrodeposition printing pure copper metal structural parts manufacturing device, the table top is horizontal, and the lower part is provided with a stable support structure;

[0036] The electrolytic cell movement unit 6 is arranged on the table top of the vibration isolation platform 1, and the electrolytic cell movement unit 6 is provided with a monitoring camera 601;

[0037] The electrolytic cell unit 5 is arranged on the electrolytic cell moving unit 6, and can mo...

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Abstract

The invention discloses a double-scale efficient localized electrochemical deposition printing pure copper structural part manufacturing device and method, and belongs to the technical field of localized electrochemical deposition. The manufacturing device comprises a vibration isolation platform, an EcP printing system, an EDM system, an LECD-mu AM system, an electrolytic tank unit, an electrolytic tank movement unit, an EcP printing movement system and a central control system. According to the method, positive manufacturing of localized electrochemical deposition of a pure copper metal microstructure is achieved through three independent steps, and two electrochemical deposition technologies are effectively connected through the electric spark forming machining technology (EDM); and on the basis of rapid material construction of millimeter-level electrochemical deposition, a to-be-deposited surface is polished by utilizing a precise electric spark forming machining technology, and finally forward manufacturing of the pure copper metal microstructure on the polished surface is achieved by utilizing an LECD-mu AM technology.

Description

technical field [0001] The invention belongs to the technical field of localized electrochemical deposition, and in particular relates to a device and method for manufacturing a pure copper structural part produced by dual-scale high-efficiency localized electrodeposition printing. Background technique [0002] Localized electrodeposition manufacturing technology has its unique advantages. This technology was proposed in 1996. After 25 years of development, it has greatly enriched the manufacturing methods of tiny metal structural parts. Localized electrodeposition has changed the manufacturing ideas of precision electroplating and electroforming, discarded the deposition mask, enhanced the localized characteristics of electrolyte directional transmission, and realized the forward manufacturing of three-dimensional cantilever structures of tiny structural parts. The development of localized electrodeposition technology benefits from the development of tiny electrode / probe ma...

Claims

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Application Information

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IPC IPC(8): C25D1/00
CPCC25D1/00Y02P10/25
Inventor 任万飞许金凯徐振铭邹兆强
Owner CHANGCHUN UNIV OF SCI & TECH
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