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PXIe backboard production tool

A technology for the production of tooling and backplanes, which is used in metal processing, improvement of metal adhesion of insulating substrates, secondary processing of printed circuits, etc.

Inactive Publication Date: 2021-09-10
深圳市厚物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a PXIe backplane production tooling. The problem to be solved by the present invention is: the existing PXIe backplane production equipment has a single function and cannot Realize the drilling function on the board

Method used

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Embodiment Construction

[0038]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] The PXIe backplane production tooling of the embodiment of the present invention may include a workbench 1, the four ends of the top of the workbench 1 are fixedly installed with support columns 11, and a top plate 12 is fixedly installed between the tops of the four support columns 11 , the top of the back side of the top plate 12 is fixedly installed with a mounting frame 13, the mounting frame 13 is also fixedly connected to the back side of the workbe...

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Abstract

The invention discloses a PXIe backboard production tool, and relates to the field of circuit board production. The PXIe backboard production tool comprises a workbench, supporting columns are fixedly installed at the four ends of the top of the workbench, a top plate is fixedly installed among the tops of the four supporting columns, a mounting frame is fixedly installed at the top of the back side of the top plate, a driving mechanism is arranged on one side of the mounting frame, a sleeve is movably installed on the top of the top plate in a penetrating mode, a connecting plate is integrally formed on one side of the top end of the sleeve, a drilling mechanism is arranged in the sleeve, and a pressing frame is fixedly connected to the bottom of the sleeve. Through the sleeve, the pressing frame and the drilling mechanism, not only is a backboard pressed and formed, but also the backboard is drilled, and the function of pressing and riveting the plate is achieved; and through a pin feeding mechanism and a plate feeding mechanism, the automatic feeding function of pins and plates is achieved in the upward moving process of the pressing frame and a pressing rivet rod.

Description

technical field [0001] The invention relates to the technical field of circuit board production, and more specifically, the invention relates to a PXIe backplane production tooling. Background technique [0002] Printed boards have been widely used since their appearance, and occupy an irreplaceable important position in modern electronic products. Printed board manufacturing technology has also been continuously developed. Different types of printed boards with different grades require different manufacturing processes. At present, multilayer copper clad laminates are the most widely used in electronic products, and the PXIe backplane is made of multilayer copper clad laminates by hot pressing. [0003] In the production process of the PXIe backplane, the PP prepreg and the memory core board (copper board) need to be alternately hot-pressed into a multi-layer copper-clad laminate. In order to improve the bonding and fixing effect between the hot-pressed multi-layer copper-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K3/00B26F1/16B26D7/02
CPCH05K3/00H05K3/38B26F1/16B26D7/025
Inventor 杨诚罗繁
Owner 深圳市厚物科技有限公司
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