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Laser processing equipment

A technology of laser processing and equipment, applied in metal processing equipment, laser welding equipment, welding equipment, etc., can solve the problems of large occupied area and low flexibility

Active Publication Date: 2021-09-17
安徽中科春谷激光产业技术研究院有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For the laser processing equipment in the prior art, taking the traditional laser marking device as an example, each laser needs to be provided with human-computer interaction by the marking software on an industrial computer, and the matching marking board receives the instructions transmitted by the computer and Execute corresponding control, and the laser processing equipment uses two separate equipment for welding and polishing, resulting in a large footprint and low flexibility

Method used

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  • Laser processing equipment
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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] see figure 1 , a kind of laser processing equipment, comprises control box 1 and processing box 2, and control box 1 is electrically connected with processing box 2, and the interior of processing box 2 is divided into upper and lower two spaces by dividing plate 3, and the upper space of processing box 2 is laid There is a processing platform 21 connected to the partition 3, the processing platform 21 is used for laser processing, a proce...

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Abstract

The invention discloses laser processing equipment and belongs to the technical field of laser processing. The equipment comprises a control box and a processing box, wherein the interior of the processing box is divided into an upper space and a lower space by means of a partition plate, a processing platform connected with the partition plate is laid in the upper space of the processing box, a processing mechanical arm is installed on the processing platform, a polishing assembly, a laser welding assembly and a lifting assembly are connected to the processing mechanical arm, and the polishing assembly ascends by means of the lifting assembly to expose the laser welding assembly and is used for working of the laser welding assembly. According to the laser processing equipment, rotary polishing and welding are combined together, a bevel gear set rotates forwards to descend a lower disc so as to expose a laser head, accurate processing is conducted according to an end opening of the laser head, the bevel gear set rotates reversely to ascend the lower disc so as to retract the laser head, and the the laser head is flush with a surface, used for polishing, of a polishing wheel, so that a polishing effect is not influenced.

Description

technical field [0001] The invention relates to the technical field of laser processing equipment, in particular to a laser processing equipment. Background technique [0002] For the laser processing equipment in the prior art, taking the traditional laser marking device as an example, each laser needs to be provided with human-computer interaction by the marking software on an industrial computer, and the matching marking board receives the instructions transmitted by the computer and The corresponding control is carried out, and the laser processing equipment uses two separate equipment for welding and polishing, resulting in a large area occupied by it and low flexibility. Contents of the invention [0003] The object of the present invention is to provide a laser processing equipment to solve the problems raised in the background art above. [0004] In order to achieve the above object, the present invention provides the following technical solutions: a laser process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P23/00B23K26/00B23K26/70
CPCB23P23/00B23K26/00B23K26/70B23K26/702Y02P70/10
Inventor 高雪松李荣
Owner 安徽中科春谷激光产业技术研究院有限公司