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Chip performance test system and test method

A chip performance and test system technology, applied in the field of optical communication, can solve the problems of low test efficiency and poor accuracy, and achieve the effect of solving low test efficiency

Pending Publication Date: 2021-09-28
GUANGXUN SCI & TECH WUHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a chip performance testing system and testing method, the purpose of which is to efficiently and automatically complete the adjustment of each device in the testing system before performing the chip performance testing, thereby solving the problem of traditional Technical problems of low test efficiency and poor accuracy in the test plan

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  • Chip performance test system and test method

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Embodiment 1

[0055] In order to solve the technical problems of low test efficiency and poor accuracy in traditional test schemes, an embodiment of the present invention provides a chip performance test system, such as Figure 1-Figure 5 As shown, it mainly includes a chip holder 101 , a test bench 201 , a controller, an imaging system connected to the controller, a DC probe 301 , a high frequency probe 401 and an optical fiber 501 . in:

[0056] The chip holder 101 is used to clamp the chip 100 to be tested, and the chip holder 101 is placed on the test bench 201 to perform the performance test of the chip to be tested 100; the imaging system is located above the test bench 201 , for collecting the image of the chip under test 100; when performing a performance test, the DC probe 301, the high frequency probe 401 and the optical fiber 501 are in contact with the chip under test 100 respectively, for The chip 100 to be tested provides a DC signal, a high frequency signal and an optical si...

Embodiment 2

[0072] On the basis of the above-mentioned embodiment 1, the embodiment of the present invention further provides a chip performance testing method, which can be completed by using the testing system in the embodiment 1. Such as Figure 10 As shown, the test method mainly includes the following steps:

[0073] Step 1: After the chip to be tested 100 is clamped by the chip holder 101, the chip holder 101 is placed within the collection range of the imaging system, and the image of the chip to be tested 100 is collected by the imaging system and fed back to the controller .

[0074] combine Figure 4 with Figure 5 , first move the first moving baffle 1011 and the second moving baffle 1012 outwards, and push the elastic piece 1013 outward; then place the chip 100 to be tested on the first Moving baffle 1011, the second moving baffle 1012, the elastic piece 1013 and the storage space formed by the fixed baffle 1014; The second moving baffles 1012 all move inward, and limit t...

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Abstract

The invention discloses a chip performance test system and a test method. The chip performance test system comprises a chip clamp, a test board, a controller, and an imaging system, a direct current probe, a high frequency probe and an optical fiber which are respectively connected with the controller, the chip clamp is used for clamping a to-be-tested chip, and the chip clamp is placed on the test bench to carry out the performance test of the to-be-tested chip. The imaging system is positioned above the test board and is used for acquiring an image of the chip to be tested; when performance testing is carried out, the direct current probe, the high frequency probe and the optical fiber are in contact with a chip to be tested. And the controller determines a chip type according to a chip image returned by the imaging system, searches corresponding adjustment data according to the chip type, and performs position adjustment on the imaging system, the direct-current probe, the high-frequency probe and the optical fiber based on the adjustment data. According to the scheme, the devices do not need to be manually adjusted one by one, dependence on artificial experience is not needed, and the problems of low test efficiency, poor accuracy and the like of traditional adjustment can be solved.

Description

【Technical field】 [0001] The invention belongs to the technical field of optical communication, and more specifically relates to a chip performance testing system and testing method. 【Background technique】 [0002] With the growth of communication services, the bandwidth requirements of transmitting devices and receiving devices are getting higher and higher, ranging from 2.5Gb / s, 10Gb / s to 25Gb / s, 50Gb / s, and as the core raw material of optical devices , the high-frequency performance test of the light emitting chip and the light receiving chip is particularly important. In the traditional test method, it is usually necessary to put the chip to be tested on the test platform first, and then manually adjust each device of the test system. After the adjustment is completed, the high-frequency performance test of the chip to be tested is performed. For example, it is necessary to adjust the position of the camera in the test system so that the camera can accurately capture th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2887G01R31/2891
Inventor 成璇璇童超蔡敬张博胡毅
Owner GUANGXUN SCI & TECH WUHAN