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Elastic wave device package and module including elastic wave device

A device packaging and elastic wave technology, applied in electrical components, impedance networks, etc., can solve the problem that elastic wave devices do not have a structure, and achieve the effect of suppressing ESD damage and improving ESD tolerance

Pending Publication Date: 2021-09-28
SANAN JAPAN TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the purpose of the above-mentioned patent documents 1 to 3 is not to suppress ESD damage, and the elastic wave device itself does not have a structure for suppressing ESD damage

Method used

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  • Elastic wave device package and module including elastic wave device
  • Elastic wave device package and module including elastic wave device
  • Elastic wave device package and module including elastic wave device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0047] figure 1 and figure 2 Referring to the first embodiment of the present invention, the conductive resin layer 4 covers the entire area of ​​the facing surface 1 c of the elastic wave device 1 and the end surface 1 d of the elastic wave device 1 .

[0048] Thereby, for example, when the elastic wave device package D is placed in a high electric field (in an atmosphere where static electricity is generated), when the elastic wave device package D generates charges due to friction between each other, or when cutting (Dicing ) process to remove the elastic wave device package D from the dicing tape (Dicing Tape), etc., can prevent the comb-shaped electrodes 1b constituting the elastic wave device 1 from being concentratedly charged.

[0049] In addition, the elastic wave device package D can be configured in a state where the conductive resin layer 4 and the encapsulating resin 3 are highly adhered to each other and are integrally molded firmly. The thickness of the condu...

no. 2 example

[0051] Figure 4 Referring to the second embodiment of the present invention, the conductive resin layer 4 includes a portion 4a connected to and covering the end face 1d of the elastic wave device 1, and a portion extending and covering at least part of the mounting side of the package substrate 2. Prolongation 4b of surface 2a.

[0052] Such as Figure 4 As shown in , the extension part 4b has a first part 4c that hangs down from the part 4a of the end surface 1d and contacts the surface 2a, and extends outward from the lower end of the first part 4c and terminates at the opposite package substrate. The end face 2c of 2 is the second portion 4d located slightly inside. and, if Figure 4 As shown, the conductive resin layer 4 has the first portion 4c and the second portion 4d no matter it is disposed at any position around the center x of the elastic wave device 1 .

[0053] In this case, firstly, the area of ​​the conductive resin layer 4 can be increased, thereby making...

no. 3 example

[0056] Figure 5 Referring to the third embodiment of the present invention, the extension portion 4b is electrically connected to the electrode 2f formed on the mounting side surface 2a of the package substrate 2 and connected to the external connection terminal 2e.

[0057] In such a case, since the charges in the conductive resin layer 4 can be easily discharged through the external connection terminal 2e, the ESD resistance of the elastic wave device package D can be improved. At this time, if the conductive resin layer 4 with an appropriate impedance value is used together, the discharge can be performed slowly, so that the high peak value of the electric field can be suppressed and the ESD tolerance can be improved.

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Abstract

An elastic wave device package according to the present invention includes an elastic wave device formed by providing a comb electrode on a surface of a piezoelectric substrate, a package substrate on which the elastic wave device is mounted and which forms a gap with the surface of the elastic wave device, and a sealing resin formed on the elastic wave device loaded on a mounting side of the package substrate. A hollow part surrounding the comb-shaped electrode is formed between the packaging substrate and the elastic wave device through the packaging resin, and at least 80% of the area of the elastic wave device relative to the surface is covered with a conductive resin layer between the packaging resin and the elastic wave device. The elastic wave device package can appropriately and rationally provide a structure capable of suppressing ESD destruction, i.e., a structure capable of improving ESD tolerance, by means of the conductive resin layer.

Description

technical field [0001] The present invention relates to improvements in elastic wave device packaging and modules containing elastic wave devices. Background technique [0002] Elastic wave devices used in mobile communication devices generally form comb-shaped electrodes (IDT: Inter-Digital Transducer) on piezoelectric substrates such as lithium tantalate or lithium niobate, and constitute, for example, band-pass filters with frequency filtering performance of the device. Taking the band-pass filter as an example, its center frequency is determined by the propagation velocity of the piezoelectric substrate used, the distance between the electrode fingers of the comb electrodes, and the length of the electrode fingers. The pitch of the electrode fingers constituting the comb-shaped electrodes of the elastic wave device tends to gradually decrease as the frequencies used in mobile communications increase in frequency in recent years. Therefore, when the comb-shaped electrod...

Claims

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Application Information

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IPC IPC(8): H03H3/02H03H9/145
CPCH03H3/02H03H9/14541H03H2003/023
Inventor 熊谷浩一中村博文门川裕
Owner SANAN JAPAN TECH CORP
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