Circuit board and manufacturing method of said circuit board

Abstract

The present invention provides a circuit board, comprising: a circuit substrate, the circuit substrate includes at least one accommodating groove, the accommodating groove includes a bottom wall and a plurality of side walls arranged around the bottom wall; an accommodating frame, the accommodating frame is arranged on In the accommodating groove, the accommodating frame includes a frame body and a limiting part, the frame body is in contact with the side wall, and the limiting part is arranged on the side of the frame body away from the side wall; the inductive element is arranged in the accommodating groove, and the frame body It is arranged between the inductance element and the side wall. The present invention also provides a manufacturing method of the above-mentioned circuit board. On the one hand, the limit part can limit the distance from the inductance element to the frame, and further limit the movement of the inductance element in the accommodating groove when it is not fixed with the connection pad, so as to avoid welding failure and electrical connection failure caused by dislocation; the other limit part On the one hand, it can be used as a reference point in the process of setting the inductive element. The positioning device can determine the reference point for placing the inductive element by grasping the position of the limit part, and further improve the position accuracy in the process of setting the inductive element.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board embedded with an inductance element and a manufacturing method thereof. Background technique [0002] In recent years, electronic products have been widely used in daily work and life, and light, thin and small electronic products have become more and more popular. As the main component of electronic products, circuit boards occupy a large space of electronic products, so the volume of circuit boards affects the volume of electronic products to a large extent. Short and small trend. With the development of miniaturization and light weight of electronic products, the application of high-complexity, high-precision and high-density circuit boards is becoming more and more extensive. By setting embedded inductive components, the space utilization rate of the circuit board is improved, the area of ​​the wiring area is reduced, and the Circuit boar...

AI Technical Summary

Problems solved by technology

[0003] In the traditional embedding process, if there is no alignment reference point, the embedded inductance element will be placed in the cavity, making it difficult to control the position accuracy, causing the position of the embedded inductance element to shift during the placement process, and the embedding of the offset occurs. Inductive components have problems such as welding failure and poor contact during the subsequent welding process. When there are many embedded parts, this problem will seriously affect the yield of the circuit board

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