High-thermal-conductivity graphene heat dissipation film and preparation method thereof

A technology of high thermal conductivity graphite and olefin heat dissipation film, applied in the field of heat dissipation film preparation, can solve the problems of poor heat dissipation effect of heat dissipation film, uneven heat dissipation performance, low mechanical properties, etc., achieve light atomic mass, high thermal conductivity, and improve the problem of agglomeration Effect

Inactive Publication Date: 2021-04-06
江苏星途新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, the heat dissipation film has poor heat dissipation effect, low mechanical pr

Method used

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  • High-thermal-conductivity graphene heat dissipation film and preparation method thereof

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Effect test

Embodiment 1

[0034]A highly conductive graphene heat prevention film, including a weight of the following weight parts: 20 parts of a styrene acrylic resin, 20 parts of a thermally conductive composite filler, 30 modified epoxy resin, 1 curing agent, 1 part and curing accelerator 2 copies;

[0035]The preparation method of the highly conductive graphene heat film includes the following steps:

[0036]In the first step, a styrene acrylic resin, a thermally conductive composite filler, a modified epoxy resin, a curing agent, and a curing promoter were added to the reaction elbow, and the temperature rising temperature rose to 75 ° C at 5 ° C / min, and the rotational speed 280R / min was stirred after 30min. Under the conditions of the addition of antifoaming agents, temperature, and speed, stirring is continued for 15 min to give the first mixture;

[0037]In the second step, the first mixture is transferred to the mold, and in a vacuum oven, the temperature is 150 ° C first solidifys 2h, and then the hig...

Embodiment 2

[0050]A highly conductive graphene heat prevention film comprising 25 parts of a styrene acrylic resin, 22 parts by heat conductive composite filler, 35 modified epoxy resins, 3 curing agents, 1 part of defoaming agent, and cure promoters 2 copies;

[0051]The preparation method of the highly conductive graphene heat film includes the following steps:

[0052]In the first step, a styrene acrylic resin, a thermally conductive composite filler, a modified epoxy resin, a curing agent, and a curing promoter were added to the reaction kettle, raised to 80 ° C at 5 ° C / min warp rate, and the rotational speed 280R / min was stirred after 40min Under the conditions of the addition of antifoaming agents, temperature, and speed, stirring is continued for 15 min to give the first mixture;

[0053]In the second step, the first mixture is transferred to the mold, and in a vacuum oven, the temperature is 150 ° C first solidifys 2h, and then the high conductive graphene heat prevention film is obtained.

[...

Embodiment 3

[0066]A highly conductive graphene heat prevention film, including a weight of the following weight, 30 parts of a styrene acrylic resin, 25 parts of a thermally conductive composite filler, 40 modified epoxy resins, 5 curing agents, 1 part of the defoaming agent, and cured promoters 2 copies;

[0067]The preparation method of the highly conductive graphene heat film includes the following steps:

[0068]In the first step, a styrene acrylic resin, a thermally conductive composite filler, a modified epoxy resin, a curing agent, and a curing accelerator were added to the reaction kettle, and the temperature was raised to 85 ° C at 5 ° C / min, and the rotational speed 280R / min was stirred after 60min. Under the conditions of the addition of antifoaming agents, temperature, and speed, stirring is continued for 15 min to give the first mixture;

[0069]In the second step, the first mixture is transferred to the mold, and in a vacuum oven, the temperature is 150 ° C first solidifys 2h, and then...

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Abstract

The invention discloses a high-thermal-conductivity graphene heat dissipation film, which is prepared from the following raw materials in parts by weight: 20-30 parts of styrene acrylic resin, 20-25 parts of thermal-conductive composite filler, 30-40 parts of modified epoxy resin, 1-5 parts of curing agent, 1 part of defoaming agent and 2 parts of curing accelerator. The invention further discloses a preparation method of the high-thermal-conductivity graphene heat dissipation film. The styrene acrylic resin has excellent heat resistance, water resistance, solvent resistance, wear resistance and scratch resistance, and the modified epoxy resin has strong toughness, impact resistance and flame retardancy due to the addition of polyurethane. The heat conduction composite filler endows the heat dissipation film with high heat conduction capability, heat dissipation performance, wear resistance and scratch resistance, the reasonable combination of the boron nitride nanoparticles and the graphene oxide overcomes the defects of a single heat conduction filler, the mutual synergistic effect of the boron nitride nanoparticles and the graphene oxide is exerted, and a heat conduction path or a heat conduction network can be formed. Therefore, the heat-conducting property and other physical properties of the composite material are greatly improved.

Description

Technical field[0001]The present invention belongs to the preparation of heat dissipation film, and in particular, to a high thermal conductive graphene heat suppression film and a preparation method thereof.Background technique[0002]As electronic devices continue to update, we need to integrate more diversified functions into a smaller volume, but there will be heat dissipation. The rise in temperature will result in slower operating speed, failure, security problems, size space restrictions, and attenuation issues in other performance in the device work. Therefore, the heat dissipation of the device has become one of the critical challenges in the design, that is, how to effectively quickly and quickly bring more calorie unit power generated by the structure, the device is getting smaller in the architecture. A variety of heat dissipation assemblies, heat sink, and heat dissipation film products are to solve the continuous improved heat dissipation requirements of electronic produ...

Claims

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Application Information

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IPC IPC(8): C08L25/14C08L63/00C08L75/08C08K13/06C08K9/10C08K9/04C08K3/36C08K3/38C08K3/04C08J5/18
CPCC08J5/18C08J2325/14C08J2463/00C08J2475/08C08K3/36C08K9/04C08K9/10C08K13/06C08K2003/385C08K2201/011C08K3/042
Inventor 李永锋崔建强许鹏天张标
Owner 江苏星途新材料科技有限公司
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