Temperature control system and temperature control method based on waste heat recovery and electronic equipment

A temperature control system and waste heat recovery technology, applied in control/regulation systems, temperature control, non-electric variable control, etc., can solve the problem of short battery life of mobile terminals, and achieve the effect of improving battery life and realizing effective utilization.

Active Publication Date: 2021-10-01
SHANGHAI WINGTECH INFORMATION TECH CO LTD
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]However, under this heat dissipation method, the heat of the components to be dissipated is dissipat

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Temperature control system and temperature control method based on waste heat recovery and electronic equipment
  • Temperature control system and temperature control method based on waste heat recovery and electronic equipment
  • Temperature control system and temperature control method based on waste heat recovery and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0075] In order to understand the above objects, features, and advantages of the present application, the plan will be further described below. It should be noted that the features of the present application and the features of the present application can be combined with each other in the case of an unable conflict.

[0076] Many of the specific details are set forth in the following description to fully understand the present application, but the present application can also employ other different from the embodiments described herein; Obviously, the embodiments in the specification are only part of the embodiments of the present application. Not all embodiments.

[0077] The present application example proposes a temperature-controlled system based on the waste heat recovery, which can be applied to a computer such as a notebook, in particular, the temperature control system includes a semiconductor sheet, which can utilize the semiconductor sheet to be refrigerated and tempera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of electronic equipment, and provides a temperature control system and a temperature control method based on waste heat recovery and electronic equipment. The temperature control system comprises a semiconductor chip, a radiator and a control unit, wherein the semiconductor chip is arranged between the radiator and the component to be cooled, and the semiconductor chip and the radiator are both connected with the control unit; the control unit is used for controlling the radiator and the semiconductor chip to work, and the semiconductor chip works in a first working mode or a second working mode; the semiconductor chip comprises a first surface and a second surface which are opposite to each other, the first surface is a surface facing a component to be cooled, and the second surface is a surface facing a radiator; in the first working mode, the temperature of the first surface is higher than that of the second surface, and the semiconductor chip generates electromotive force based on the temperature difference between the first surface and the second surface; in the second working mode, the semiconductor chip generates a temperature difference between the first surface and the second surface based on external electromotive force driving, and the temperature of the first surface is lower than that of the second surface.

Description

technical field [0001] The present application relates to the field of electronic equipment, in particular to a temperature control system based on waste heat recovery, a temperature control method and electronic equipment. Background technique [0002] With the development of electronic technology, more and more functions are integrated in mobile terminals (ie, electronic devices) such as notebooks, and their heat generation gradually increases, correspondingly, the number of parts to be dissipated gradually increases. [0003] At present, the heat dissipation methods of mobile terminals include heat pipes, but the heat dissipation capacity of passive heat dissipation methods such as heat pipes cannot be adjusted, resulting in poor heat dissipation effects. Aiming at this, a heat dissipation method using heat pipe plus forced air cooling is proposed, in which the heat dissipation capacity of the heat pipe can be indirectly adjusted by intelligently adjusting the speed of th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G05D23/20
CPCG05D23/20Y02D10/00
Inventor 陶建云
Owner SHANGHAI WINGTECH INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap