Wire rod tin pick-up carrier, tin pick-up device comprising the carrier and tin pick-up process of the wire rod tin pick-up carrier

Abstract

The invention relates to the technical field of wire rod tin pick-up, in particular to a wire rod tin pick-up carrier, a tin pick-up device comprising the carrier and a tin pick-up process of the wire rod tin pick-up carrier, the carrier can more stably clamp wire rods and guarantee the consistency of the fixing positions of the multiple wire rods, and the wire rod tin pick-up device drives a tin containing box to ascend and descend through a lifting mechanism; and the tin containing box ascends and descends in a heat preservation groove filled with tin liquid, the tin containing box is driven by the lifting mechanism to sink into the heat preservation groove every time tin dipping is finished, the tin liquid in the tin containing box is in a full liquid state every time the tin containing box descends, and the tin containing box is driven by the lifting mechanism to return to the position of the same height every time. Therefore, the liquid level of the tin liquid in the tin containing box is ensured to be at the same horizontal height during each time of tin pick-up, the consistency of tin pick-up positions each time is further ensured, and the tin pick-up quality is improved.

Description

technical field [0001] The present application relates to the technical field of tinning wire rods, in particular to a carrier for dipping tin, a tin dipping device including the carrier and a tin dipping process thereof. Background technique [0002] With the rapid development of electronic information technology, products used to transmit electrical signals such as wires have developed rapidly. In order to provide stable protection for the wire and ensure the stability of signal transmission, shielding covers are generally installed at the end of the wire, and tinplate shields are often used. During production, the tinplate shield needs to be soldered to the end of the wire. . During production and processing, it is necessary to first fix the shielding cover to the end of the wire, and then dip the surrounding side of the shielding cover with tin liquid, which is called tinning the wire, and finally perform soldering. [0003] In the existing related technology, there is...

AI Technical Summary

Problems solved by technology

[0003] In the existing related technology, there is manual tin dipping for wire rod dipping, that is, the operator holds the wire rod and immerses the end part of the wire rod into the tin liquid for tin dipping. However, it is difficult to control the depth of tin dipping each time manually. The tin precision is poor; an automatic tin dipping machine was developed later, which can dip multiple wires simultaneously, but using the automatic tin dipping mechanism for dipping tin has the following problems: 1. Multiple wires require tinning and immersion height It must be completely consistent, otherwise it will lead to inconsistent tinning of each wire, especially for wire joints with high quality requirements, more attention should be paid to it; 2. After a period of use, the level of the surface of the tin liquid will drop, which will make the immersion of tinning The depth changes, which in turn affects the accuracy of tin dipping

[0004] To sum up, there is a problem in the tin dipping methods in related technologies: that is, the tin dipping method is not accurate enough, resulting in incomplete and accurate tin coating at the end of the wire, and the soldering forming effect is average, which ultimately affects the soldering molding quality of the product.

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