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Electronic package

A technology for electronic packaging and electronic components, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as poor heat transfer, damage to product reliability, etc., and achieve the effect of increasing heat dissipation area and avoiding damage

Pending Publication Date: 2021-10-12
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing semiconductor package 1, the semiconductor element 11 and the passive element 11' will generate a large amount of heat energy during operation, and the encapsulant 14 covering the semiconductor element 11 and the passive element 11' is a heat-conducting A poor heat transfer material with a coefficient of only 0.8Wm-1k-1 (that is, the heat dissipation efficiency is not good), so the heat generated cannot be effectively dissipated, so it will cause damage to the semiconductor element 11 and the passive element 11' or cause Product Reliability Issues

Method used

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Embodiment Construction

[0044] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0045] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "upper", "lower", "first", "second" and...

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Abstract

An electronic package includes a bearing structure, a plurality of electronic components disposed on the bearing structure and electrically connected to the bearing structure, a cladding layer formed on the bearing structure, and a sheet-like functional member embedded in the cladding layer and having at least one through hole exposing the functional member through the cladding layer. Therefore, the functional part can dissipate heat only by being close to the periphery of the electronic component without being combined with the electronic component, so that the heat dissipation area on the bearing structure is increased.

Description

technical field [0001] The invention relates to a package structure, especially an electronic package with heat dissipation function. Background technique [0002] With the vigorous development of portable electronic products in recent years, various related products are gradually developing towards the trend of high density, high performance, lightness, thinness, shortness and smallness. The structure of the semiconductor package is thus coordinated with the innovation in order to meet the requirements of light, thin, small and high density. [0003] figure 1 It is a schematic cross-sectional view of a conventional semiconductor package 1 . The semiconductor package 1 is provided with a semiconductor element 11 and a passive element 11' on the upper and lower sides of a circuit structure 10, and then the semiconductor element 11 and the passive element 11' are covered with a molding compound 14, and the The contact (I / O) 100 of the wiring structure 10 exposes the encapsu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/31H01L25/16
CPCH01L23/367H01L23/3107H01L25/16
Inventor 蔡宗贤蔡明泛林建成杨超雅陈嘉扬
Owner SILICONWARE PRECISION IND CO LTD
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