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Laser processing apparatus and laser processing method

A technology for laser processing and processing, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., and can solve problems such as measuring small holes

Pending Publication Date: 2021-10-22
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is concern that the depth of the small hole cannot be accurately measured by measuring light

Method used

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  • Laser processing apparatus and laser processing method
  • Laser processing apparatus and laser processing method
  • Laser processing apparatus and laser processing method

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Experimental program
Comparison scheme
Effect test

Embodiment approach

[0042] Hereinafter, the laser processing apparatus according to the embodiment of the present disclosure will be described item by item.

[0043]

[0044] First, use figure 1 The structure of the laser processing apparatus 1 which concerns on embodiment of this disclosure is demonstrated.

[0045] figure 1 It is a figure which schematically shows the structure of the laser processing apparatus 1 of this embodiment.

[0046] like figure 1 As shown, the laser processing apparatus 1 of this embodiment includes a processing head 2, an optical interferometer 3, a measurement processing unit 4, a laser oscillator 5, a control unit 6, a first driver 7, a second driver 8, and the like.

[0047] The optical interferometer 3 emits measurement light 15 for OCT measurement. The emitted measurement light 15 is input to the processing head 2 from the measurement light introduction port 9 provided on the second reflection mirror 17 .

[0048] The laser oscillator 5 oscillates a pro...

Deformed example 1

[0248] In the above-mentioned embodiment, in order to change the direction of the optical axis of the measurement light 15 , the case where the second reflection mirror 17 which is a galvano mirror is used was exemplified and described, but the present invention is not limited thereto.

[0249] The second reflection mirror used in the laser processing device 1 may be, for example, configured as follows: it is arranged between the measurement light introduction port 9 and the dichroic mirror 12, and the direction of the optical axis of the measurement light 15 can be adjusted based on the control of the control unit 6. changes such as Figure 25 The structure of the second reflecting mirror 35 is shown.

[0250] Figure 25 It is a figure which schematically shows the laser processing apparatus 1 using the 2nd reflection mirror 35. As shown in FIG.

[0251] Figure 25 The laser processing device shown in 1 replaces the figure 1 The second reflection mirror 17 shown by etc. ...

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Abstract

The invention provides a laser processing apparatus and a laser processing method. The laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, and sets a plurality of data acquisition positions, which are trajectories perpendicular to a processing direction, in the measurement section. Further, during processing in the processing section, the laser processing apparatus acquires measurement data indicating the shape of each small hole at the data acquisition positions, and creates projection data in which the measurement data is projected in the processing direction and overlaps the measurement data. Then, the laser processing apparatus obtains a second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. As a result, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring the depth of small holes.

Description

technical field [0001] The present disclosure relates to a laser processing device and a laser processing method. Background technique [0002] For example, JP 2018-501964 A (hereinafter referred to as "Patent Document 1") discloses a laser processing device. The laser processing apparatus uses OCT (Optical Coherence Tomography, optical coherence tomography) technology for visualizing the internal structure of a sample by optical interference tomography, and measures the depth of a keyhole (keyhole) generated in metal processing by laser light. [0003] Below, use Figure 26 , the laser processing device of Patent Document 1 will be described. Figure 26 It is a figure which schematically shows the structure of the laser processing apparatus disclosed by patent document 1. [0004] like Figure 26 As shown, a processing laser 107 and a measurement light 105 are introduced into a welding head 108 . The measurement light 105 passes through the collimation module 106 and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/064
CPCB23K26/06B23K26/064B23K26/0643B23K26/0648B23K26/032B23K26/082
Inventor 横山润武智洋平
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD