Chip resistor conductor layer printing equipment and using method thereof

Abstract

The invention discloses chip resistor conductor layer printing equipment and a using method thereof. The chip resistor conductor layer printing equipment comprises a working platform and a printing box arranged on the upper end face of the working platform. The chip resistor conductor layer printing equipment is characterized in that the upper end face of the printing box is fixedly connected with two mounting plates, and an equipment box body is arranged between the two mounting plates; a plurality of heating plates are arranged in a cavity of the equipment box body; ventilation pipes are arranged on the two sides of the equipment box body, and the ends, away from the equipment box body, of the ventilation pipes penetrate into the printing box; and opening and closing doors are movably arranged on the two sides of the printing box, and driving mechanisms used in cooperation with the opening and closing doors are arranged on the upper end face of the printing box. Through cooperation of the equipment box body, the heating plates and the ventilation pipes, the ventilation pipes continuously convey air heated to a certain temperature into the equipment box body, the inside of the printing box is kept at high temperature all the time, heat loss in the printing box is supplemented, and when a next workpiece is machined every time, the temperature rise time of the working bin of the printing box is shortened, and energy consumption is reduced.

Description

technical field [0001] The invention relates to the technical field of printing equipment, in particular to a printing equipment for a chip resistance conductor layer and a method for using the same. Background technique [0002] SMD resistor, also known as chip fixed resistor, is a kind of metal glass glaze resistor. It is a resistor made by mixing metal powder and glass glaze powder and printing on the substrate by screen printing method. It is resistant to humidity and high temperature. The temperature coefficient is small, which can greatly save the cost of circuit space and make the design more refined. [0003] The existing chip resistors need to be printed on the conductor layer during production. During printing, the loading template needs to be heated at a high temperature so that the conductor layer is attached to the chip resistors. However, each time a batch of resistors is processed, the next step When printing a batch of resistors, the temperature inside the p...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a printing device for chip resistor conductor layer and its use method, which can solve the existing problem: the traditional printing device cannot maintain the temperature in the printing device, and it needs to be heated to the set temperature every time, which can high power consumption

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