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Lens packaging module and manufacturing method thereof

A manufacturing method and technology of lens components, which are applied in installation, television, optics, etc., can solve problems such as loss of production yield, cutting chipping, cracking under pressure, etc., and achieve the goals of improving pollution, avoiding damage, and reducing packaging costs Effect

Pending Publication Date: 2021-10-26
TRIPLE WIN TECHSHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the assembly process of cameras and image recognition modules, dust and glue pollution on photosensitive / luminescent elements and filter components are the main defects that affect product quality, and are also the largest factor for the loss of production yield. These defects are usually only in the finished lens. , The refractor is easy to be detected after it is adhered. Due to the irreversible factors of the manufacturing process, scrapping is often the only way to deal with these defective products
[0003] Ceramic substrate is currently the most common substrate material for cameras and image recognition modules due to its high strength, high thermal conductivity, high thermal cycle performance, high insulation, and low thermal expansion coefficient. Generally, a single substrate is used in a single substrate, and multiple chips are placed in a matrix tray for packaging and processing, resulting in high packaging costs.

Method used

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  • Lens packaging module and manufacturing method thereof
  • Lens packaging module and manufacturing method thereof
  • Lens packaging module and manufacturing method thereof

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Embodiment Construction

[0029] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-8 As well as the preferred implementation mode, the specific implementation, structure, features and effects of the lens packaging module provided by the present invention and its manufacturing method are described in detail as follows. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intervening element at the same time. When an ...

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Abstract

A manufacturing method of a lens packaging module comprises the following steps: providing a circuit board which is provided with a first optical channel; mounting at least one surface bonding element on the circuit board, and electrically connecting the surface bonding element with the circuit board; placing the circuit board with the surface bonding element in a mold, performing glue injection, forming a glue sealing body layer wrapping the surface bonding element on the circuit board, the glue sealing body layer comprising a second optical channel, and the second optical channel directly facing the first optical channel; carrying out surface treatment on the circuit board after the sealing colloid layer is formed; and providing a filter element, and fixing the filter element in the second optical channel and facing the first optical channel. The invention also relates to a lens packaging module. According to the lens packaging module and the manufacturing method thereof provided by the invention, pollution and damage to the chip in the glue injection process can be improved, and the cost can be reduced.

Description

technical field [0001] The invention relates to a lens packaging module and a manufacturing method thereof. Background technique [0002] During the assembly process of cameras and image recognition modules, dust and glue pollution on photosensitive / light-emitting elements and filter components are the main defects that affect product quality, and are also the largest factor for the loss of production yield. These defects are usually only in the finished lens. , Refractors are easily detected after they are adhered. Due to the irreversible factors of the manufacturing process, scrapping is often the only way to deal with these defective products. [0003] Ceramic substrates are currently the most common substrate materials for cameras and image recognition modules due to their high strength, high thermal conductivity, high thermal cycle performance, high insulation, and low thermal expansion coefficient. Usually, a single substrate is used in a single substrate, and multipl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B7/00G03B11/00H04N5/225
CPCG02B7/006G03B11/00H04N23/55
Inventor 李怡志
Owner TRIPLE WIN TECHSHENZHEN CO LTD