High-speed large-area-array infrared imaging circuit
A technology of infrared imaging and large area array, applied in the direction of electric radiation detector, radiation pyrometry, measuring device, etc., to reduce acquisition noise, reduce target loss, and improve the effect of sensitive area
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2021-11-05
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of microelectronics and optoelectronics, and in particular relates to a high-speed large-area array infrared imaging circuit. Background technique
[0002] Infrared imaging technology has become a research hotspot in the world today in the military field. The advent of the third generation of infrared detectors has brought infrared imaging technology to another level in military applications. High frame rate and large area array detectors also emerged as the times require. The application of high frame rate and large area array infrared detector in the seeker system greatly improves the performance of the seeker. Multi-arrays can increase the sensitivity threshold of the product, allowing the product to detect farther targets; high frame rates can quickly update the target information of the product, making the pre-push trajectory of the missile more accurate, increasing the bandwidth, reducing target loss...
Examples
Embodiment Construction
[0047] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.
[0048] figure 1 It is a structural block diagram of the high-speed large area array infrared imaging circuit of the present invention. like figure 1 As sho...