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Lifting mechanism and laser processing device

A lifting mechanism and worktable technology, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of occupation, large volume of laser processing equipment, and long lifting linear module.

Active Publication Date: 2021-11-09
SHENZHEN TETE SEMICON EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the laser processing device, when adjusting the focal length of the laser head, the lifting linear module is usually used to roughly adjust the focal length of the laser head. Because the lifting linear module is relatively long, it takes up more space when it is applied to the laser processing device. , resulting in a larger laser processing device, which in turn occupies a larger production space

Method used

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  • Lifting mechanism and laser processing device
  • Lifting mechanism and laser processing device
  • Lifting mechanism and laser processing device

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0032] It should be noted that if there are directional indications (such as up, down, left, right, front, back, etc.) involved in the embodiments of the present invention, the directional indications are only used to explain a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in...

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Abstract

The invention provides a lifting mechanism and a laser processing device. The lifting mechanism comprises a workbench, first bases, second bases, bearing platforms and first transmission parts; the first bases are movably arranged on the workbench in the front-back direction, and the back sides of the first bases are provided with inclined faces from top to bottom; the second bases are movably arranged on the first bases along the inclined faces; the bearing platforms are movably arranged on the second bases, and the bearing platforms are movably connected to the workbench in the vertical direction; and the first transmission parts are arranged on the inclined faces and connected with the first bases and the second bases, and the first transmission parts are used for driving the second bases to move in the direction opposite to the moving direction of the first bases so as to drive the bearing platforms to move up and down. According to the lifting mechanism, the height of an existing lifting mechanism can be reduced, so that the size of the lifting mechanism is reduced.

Description

technical field [0001] The invention relates to the technical field of intelligent devices, in particular to a lifting mechanism and a laser processing device. Background technique [0002] At present, in the laser processing device, when adjusting the focal length of the laser head, the lifting linear module is usually used to roughly adjust the focal length of the laser head. Because the lifting linear module is relatively long, it takes up more space when it is applied to the laser processing device. , resulting in a larger volume of the laser processing device, thereby occupying a larger production space. Contents of the invention [0003] The main purpose of the present invention is to provide a lifting mechanism, aiming at reducing the height of the existing lifting mechanism so as to reduce the volume of the lifting mechanism. [0004] In order to achieve the above object, the present invention proposes a lifting mechanism, comprising: [0005] workbench; [0006...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/04B23K26/70
CPCB23K26/048B23K26/702Y02P70/50
Inventor 李文强杨建新朱霆周学慧张凯
Owner SHENZHEN TETE SEMICON EQUIP CO LTD