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Integrated circuit plastic packaging film injection equipment

A technology of integrated circuits and injection equipment, applied in the field of integrated circuit plastic film injection equipment, can solve problems such as failure of injection tube failure warning, affecting other chip packaging, affecting normal startup injection, etc., to achieve fast replacement, easy disassembly and maintenance. , the effect of quick replacement

Active Publication Date: 2021-11-09
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Packaging is to package chips and lead frames. Common packages include metal packages, plastic packages, and ceramic packages. Plastic packages are widely used. In actual plastic packages, multiple chips are usually injected and packaged at one time. , it is impossible to give an early warning of the injection tube failure, and the user can only find out after the injection tube is completely blocked, which leads to a delay in fault discovery and processing; when one injection tube fails, it is necessary to stop the machine to replace or repair the faulty injection head, which affects the operation of other injection tubes , which in turn affects the packaging of other chips; after the injection tube is closed, because the material transportation in the tube is stopped, the melted plastic inside will gradually cool down and harden, thus affecting the subsequent normal start-up injection

Method used

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  • Integrated circuit plastic packaging film injection equipment
  • Integrated circuit plastic packaging film injection equipment
  • Integrated circuit plastic packaging film injection equipment

Examples

Experimental program
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Effect test

Embodiment Construction

[0024] see Figure 1-2 , integrated circuit plastic film injection equipment, including a support rod 1, a telescopic tube 2 and a quick-change tube assembly 8, the telescopic tube 2 is arranged above the quick-change tube assembly 8, and the side wall of the telescopic tube 2 assembly Slidingly connected to the side wall of the support rod 1, the quick tube change assembly 8 is rotatably connected to the side wall of the support rod 1, the middle part of the telescopic tube 2 is provided with a quick closing component 3, and the telescopic tube The side wall of 2 communicates with a blockage alarm assembly 4, and the second end of the support rod 1 is provided with two or more than two slide holes, and a slide bar 5 is slidably connected in the slide hole, and the slide bar The second end of 5 is fixedly connected with a base 6 , the side wall of the base 6 is fixedly connected with a first cylinder 7 , and the other end of the first cylinder 7 is fixedly connected with the s...

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PUM

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Abstract

The invention discloses integrated circuit plastic packaging film injection equipment which comprises a supporting rod, a telescopic pipe and a quick pipe replacement assembly. The telescopic pipe is arranged above the quick pipe replacement assembly; the side wall of the telescopic pipe assembly is in sliding connection with the side wall of the supporting rod; the quick pipe replacement assembly is rotationally connected to the side wall of the supporting rod; and a quick closing assembly is arranged in the middle of the telescopic pipe, and the side wall of the telescopic pipe communicates with a blockage alarming assembly. According to the integrated circuit plastic packaging film injection equipment, the aim of early warning or alarming on blockage in an injection pipe is achieved by arranging the blockage alarming assembly; by arranging the quick closing assembly, when one injection pipe breaks down and needs to be processed, a pipeline is quickly and directly cut off by utilizing the closing assembly, the situation that other injection work is influenced by shutdown operation is avoided; and by arranging the quick pipe replacing assembly, the blocked injection pipe can be quickly replaced, and the influence on injection is reduced.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging. Specifically, it is integrated circuit plastic film injection equipment. Background technique [0002] Packaging is to package chips and lead frames. Common packages include metal packages, plastic packages, and ceramic packages. Plastic packages are widely used. In actual plastic packages, multiple chips are usually injected and packaged at one time. , it is impossible to give an early warning of the injection tube failure, and the user can only find out after the injection tube is completely blocked, which leads to a delay in fault discovery and processing; when one injection tube fails, it is necessary to stop the machine to replace or repair the faulty injection head, which affects the operation of other injection tubes , which in turn affects the packaging of other chips; after the injection tube is closed, because the material transportation in the tube is stopped, the...

Claims

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Application Information

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IPC IPC(8): B29C45/22B29C45/23B29C45/74B29C45/17
CPCB29C45/22B29C45/23B29C45/74B29C45/17
Inventor 崔洋梁继然
Owner TIANJIN UNIV
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