The present application relates to the field of
electronic component welding, and particularly relates to a water-washing
soldering paste and an application method thereof. The water-washing
soldering paste comprises a first paste and a second paste. The first paste comprises a
solvent,
alloy powder and
triisopropanolamine. The second paste comprises the
solvent, water-based
epoxy resin, activator, thixotropic agent and
antioxidant. The
solvent only comprises one or more of amphiphilic
alcohol compound, polyhydric
alcohol compound, polyether compound and glycol
ether compound. The activator is
organic acid. The
antioxidant comprises phenolic compound and phosphite compound.
Triisopropanolamine, as a
corrosion inhibitor, promotes the cross-linking of water-based
epoxy resin on the surface of
alloy powder particles to form a dense protective film, and inhibits the
hydrolysis of
antioxidant and the oxidation of
metal particles, thereby reducing the risk of grape effect.