The present application relates to the technical field of circuit board production, in particular to a circuit board thin
tin selective
etching method with etch
resist protection; after cleaning and
drying the circuit board to be etched, the circuit board is subjected to micro-
etching treatment with a micro-
etching solution, then a thin
tin layer is formed on the surface of the circuit board through
electroplating process, then the etch
resist is evenly coated on the thin
tin layer, the
copper-clad circuit board coated with the etch
resist is subjected to
exposure, the exposed thin tin layer is subjected to selective etching with an etching solution, after the etching is completed, the circuit board is subjected to film removal with
sodium hydroxide solution, then the circuit board is washed with deionized water and dried, and the selective etching of the circuit board thin tin is completed. The circuit board thin tin selective etching method with etch resist protection provided by the present application can not only ensure that the
copper surface and the solidified etch resist have strong bonding force, thereby reducing the loss amount of
copper, but also shorten the film removal time and enable selective etching of the etching area.