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Power electronic device with automatic ventilation module

A technology of power electronics and equipment, applied in the field of power electronics equipment, can solve the problems of external foreign matter inflow and low heat dissipation efficiency, and achieve the effect of preventing foreign matter from entering from the outside and improving heat dissipation efficiency

Pending Publication Date: 2021-11-12
LS ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the absence of a fan, the existing power electronic equipment uses natural convection to dissipate the heat of the radiator, so there is a problem of low heat dissipation efficiency
[0009] In addition, in the case of installing a fan to improve heat dissipation efficiency, although the heat dissipation efficiency can be improved, the main inlet hole and the main outlet hole are always open, so there are external air that continues to circulate regardless of temperature, and external foreign objects Problems flowing into the inside of the inverter

Method used

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  • Power electronic device with automatic ventilation module
  • Power electronic device with automatic ventilation module
  • Power electronic device with automatic ventilation module

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Embodiment Construction

[0047] The above objects, features, and advantages will be described in detail below with reference to the accompanying drawings, so that those skilled in the art to which the present invention pertains can easily implement the technical idea of ​​the present invention. During the description of the present invention, if it is judged that the detailed description of the known technology related to the present invention may obscure the gist of the present invention, its detailed description will be omitted. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals refer to the same or similar constituent elements.

[0048] Hereinafter, an arbitrary structure is arranged "upper (or lower)" of a constituent element or "above (or lower)" of a constituent element, not only may mean that any constituent is in contact with the top surface (or bottom surface) arrang...

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PUM

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Abstract

The present invention relates to a power electronic device with an automatic ventilation module, comprising: an enclosure in which a heating component is accommodated and which forms an exterior; and an automatic ventilation module, installed on one side of the enclosure, for opening and closing a part of the enclosure according to the temperature of the heating component, wherein the automatic ventilation module comprises: a driving unit, installed on one side of the inside of the enclosure, for generating power; a connection unit for transmitting the power generated by the driving unit; a ventilation unit for receiving the power from the connection unit and provided with a front plate for opening and closing a part of the enclosure; a temperature sensor, installed inside the enclosure, for measuring the temperature of the inside of the enclosure; and a control unit for controlling the driving unit on the basis of a measured value of the temperature sensor so as to adjust the degree of opening and closing of the front plate.

Description

technical field [0001] The invention relates to a power electronic device with an automatic ventilation module that detects temperature and automatically dissipates heat according to the temperature of the power electronic device. Background technique [0002] Generally, industrial power electronic equipment is used outdoors or indoors in a form in which main components and heat dissipation structures are installed inside the casing. The industrial power electronic equipment may be, for example, a power conversion device such as an inverter. Industrial power electronic equipment such as inverters often discharge high-temperature heat, so there is a ventilation structure for heat dissipation. [0003] figure 1 It shows an example of a conventional heat radiation structure of an electronic device. figure 2 is showing figure 1 Side view of the cooling structure of a power electronics device. [0004] Such as figure 1 As shown, the existing power electronic device 1 is an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20909H05K7/20145H05K7/20945
Inventor 黄修镛
Owner LS ELECTRIC CO LTD