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Glue pump testing system and method

A test system and test method technology, applied in the direction of pump test, liquid variable displacement machinery, machine/engine, etc., can solve the problem of not being able to judge whether the accuracy of the rubber pump meets the requirements, etc., to achieve convenient test process, save manpower, and test results precise effect

Active Publication Date: 2021-11-19
宁波润华全芯微电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the embodiment of the present invention provides a rubber pump testing system and method, which can effectively solve the problem that it is impossible to determine whether the accuracy of the rubber pump meets the requirements

Method used

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  • Glue pump testing system and method
  • Glue pump testing system and method

Examples

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no. 1 example

[0042] See Figure 1-2 The embodiment of the present invention provides an adhesive pump test system 100 for testing the gum of the adhesive pump 110. Among them, the pump 110 is provided with an inlet 111 and a glue port 112. The glue pump test system 100 includes, for example, a welding device 120, a weighting device 130, and a controller 140, wherein the welding device 120 communicates with the adhesive opening 111 for conveying the glue of the glue pump 110; the weight reducer 130 includes a glue After the liquid container 131 and the weight acquisition device 132, the collapse container 131 communicates the rubber port 112, the adhesive pump 110 is conveyed to the collant container 131, and the weight information is obtained by the weight acquisition device 132; the controller 140 is connected. The adhesive pump 110, the controller 140 is used to provide a single epitary of the adhesive pump 110, and the control adhesive pump 110 performs the glue operation, and receives the w...

no. 2 example

[0067] See Figure 7-8 The second embodiment of the present invention provides a cylindrical pump test method, including, for example,:

[0068] S1: The controller 140 provides a preset glue A of the adhesive pump 110;

[0069] S2: The weight acquisition device 132 acquires the weight M before the rubber container 131 adhesive 0

[0070] S3: The adhesive pump 110 operates, the adhesive pump 110 out of the glue to the glue container 131;

[0071] S4: The weight acquisition device 132 acquires the weight M after the glue container 131 into the rubber container 1 ;

[0072] S5: Controller 140 calculates the actual epithelium △ m = m 1 -M 0 .

[0073] In a specific embodiment, it is to be explained that when the rubber pump test method is performed in multiple times, the weight difference acquired by the weight acquisition device 132 is an actual glue. For example, the first actual epithelium △ m 1 = M 1 -M 0 ; Second actual epithelium △ m 1 = M 2 -M 1 ; Where M 2 The weight acquisiti...

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Abstract

The invention discloses a glue pump testing system and method. The glue pump testing system comprises a glue supply device which is communicated with a glue inlet; a weight measuring device which comprises a glue solution container and a weight acquisition device, the glue solution container being communicated with a glue outlet; and a controller which is connected with a glue pump, and used for setting the single glue output amount of the glue pump, controlling the glue pump to carry out the glue output action and receiving weight measurement information of the weight acquisition device. The problem that whether the precision of the glue pump meets the requirement or not cannot be judged is effectively solved.

Description

Technical field [0001] The present invention relates to semiconductor processing, and more particularly to a glue pump test system and method. Background technique [0002] In the semiconductor industry, the lithography process is very wide. The basic process of lithography is made of photoresist coating, exposure, development and other steps. The photoresist itself can be present in a liquid state and can be delivered by a pump. However, the coating process of the photoresist requires quantitative delivery of photoresist, so the accuracy of the adhesive pump is particularly important. [0003] In the prior art, there is no apparatus or method for testing the amount of glue of the rubber pump, and thus the actual epitax of the glue pump cannot be measured, and it is impossible to determine whether the accuracy of the rubber pump is required. Inventive content [0004] Therefore, the embodiment of the present invention provides a glue pump test system and method, which effectivel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F04B51/00
CPCF04B51/00
Inventor 王冲王伟史习赟
Owner 宁波润华全芯微电子设备有限公司