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Preparation method of LED light-emitting film

A light-emitting film and LED chip technology, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as the inability to form thin-film light-emitting devices

Pending Publication Date: 2021-11-26
SHANGHAI KERUN PHOSPHOR TECH
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  • Abstract
  • Description
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Problems solved by technology

[0003] Electroluminescent devices are a type of semiconductor light-emitting phenomenon caused by the current and voltage applied between two electrodes. Light-emitting diodes (LEDs) are a type of low-voltage electroluminescent devices. It has been widely used in the field of lighting and display. Since the LED chip needs to lead out two electrodes and package it, the LED light-emitting device has a large volume and cannot form a thin-film light-emitting device.

Method used

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  • Preparation method of LED light-emitting film
  • Preparation method of LED light-emitting film
  • Preparation method of LED light-emitting film

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Embodiment Construction

[0022] A method for preparing an LED luminous film, its structure comprises: a transparent base film 3 , an LED luminescent layer 2 , a positive electrode 4 , a negative electrode 5 , and a transparent protective film 6 . It is characterized in that the LED light-emitting layer 2 is formed by mixing the LED chip 1 and transparent glue containing conductive ions. Firstly, the transparent base film 3 provides a smooth plane base, and PET has better stability as a transparent base film, and can be used for the uniform preparation of the LED light-emitting layer. The LED light-emitting layer includes LED chips and transparent glue. The LED chips are arranged in an orderly manner or mixed with the transparent glue in a disordered manner. The LEDs are arranged in an orderly manner to display patterns and characters, and the mixed LEDs in disorder can produce double-sided, especially using alternating current. The number of LED chips contained in the LED light-emitting layer depends ...

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Abstract

The invention provides a preparation method of an LED light-emitting film. The LED light-emitting film sequentially comprises a transparent basic film, an LED light-emitting layer, a positive electrode, a negative electrode and a transparent protective film, the LED light-emitting layer is formed by mixing an LED chip and transparent adhesive containing conductive ions, the positive electrode and the negative electrode are arranged on two sides of the LED light-emitting layer, and when alternating current or direct current is loaded, the LED chip emits light.

Description

technical field [0001] The invention belongs to the preparation and application in the field of LED semiconductor light-emitting devices. [0002] technical background [0003] Electroluminescent devices are a type of semiconductor light-emitting phenomenon caused by the current and voltage applied between two electrodes. Light-emitting diodes (LEDs) are a type of low-voltage electroluminescent devices. It has been widely used in the field of lighting and display. Since the LED chip needs to lead out two electrodes and package it, the LED light-emitting device has a large volume and cannot form a thin-film light-emitting device. [0004] A preparation method of LED luminous film of the present invention, it comprises in turn: transparent basic film, LED luminous layer, positive electrode, negative electrode, transparent protective film, it is characterized in that LED luminous layer is made of LED chip and contains the transparent glue that contains conductive ion It is form...

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Application Information

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IPC IPC(8): H01L33/42H01L33/00
CPCH01L33/42H01L33/005H01L2933/0016
Inventor 张瑞君宋长波周金水全丽华陈磊蒋赟郑凯岩陈君燕郑岩
Owner SHANGHAI KERUN PHOSPHOR TECH
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