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Method for improving reliability of electromagnetic shielding film impedance matching requirement product

An electromagnetic shielding film and impedance matching technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as cost increase, achieve the effects of reducing residual copper rate, widening line width, and improving product reliability

Inactive Publication Date: 2021-11-26
BOMIN ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The technical problem to be solved in the present invention is to provide a method for improving the reliability of products required for impedance matching of electromagnetic shielding films in view of the deficiencies in the prior art, and to solve the problem that the current solutions for impedance matching will cause cost increases

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  • Method for improving reliability of electromagnetic shielding film impedance matching requirement product
  • Method for improving reliability of electromagnetic shielding film impedance matching requirement product
  • Method for improving reliability of electromagnetic shielding film impedance matching requirement product

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Embodiment Construction

[0030] Below in conjunction with embodiment, the present invention is further described, but does not constitute any restriction to the present invention, anyone makes the limited number of amendments in the scope of claims of the present invention, still within the scope of claims of the present invention.

[0031] refer to figure 2 , a method for improving the reliability of products required for impedance matching of electromagnetic shielding films according to the present invention, laying differential signal lines in the signal layer of the circuit board, and laying two groups of intersecting grid lines in the reference layer below the differential signal lines 1 constitutes a grid copper layer, and the routing direction of the differential signal lines is the same as that of one group of grid lines 1 . In the conventional 45° grid copper layer design scheme, the differential signal lines are routed horizontally or vertically directly above the grid copper. Such routing...

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Abstract

The invention discloses a method for improving the reliability of an electromagnetic shielding film impedance matching requirement product, relates to circuit board manufacturing, and solves the technical problem that the cost is increased due to an existing impedance matching scheme. Differential signal lines are laid in a signal layer of a circuit board, a grid copper layer formed by two groups of mutually crossed grid lines is laid in a reference layer below the differential signal lines, and the wiring direction of the differential signal lines is the same as that of one group of grid lines. Impedance matching of the differential signal line is easy to achieve, and the product reliability can be improved on the premise that the product cost is not increased.

Description

technical field [0001] The invention relates to the production of circuit boards, more specifically, it relates to a method for improving the reliability of products required for impedance matching of electromagnetic shielding films. Background technique [0002] Among the double-sided flexible printed boards, the industry's most basic, conventional, and largest-used flexible copper-clad laminate FCCL is 1mil1 / 3oz double-sided. figure 1 It is a common structure of flexible printed boards. The reference layer adopts an oblique 45° grid with a line width of about 0.1mm and a line spacing of about 0.4mm, and the signal lines are laid directly on the signal layer. If there is a differential signal line in the signal layer, and its impedance is 100+ / -10ohm matching requirements, generally the line width of the impedance line needs to be less than 0.03mm to meet the impedance matching requirements, and the front of the signal line needs to be mounted with electromagnetic Shieldi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40H05K1/11H05K1/02
CPCH05K3/0002H05K3/40H05K1/025H05K1/11H05K1/118
Inventor 沈雷陈世金梁鸿飞许伟廉吴熷坤冯冲韩志伟
Owner BOMIN ELECTRONICS CO LTD
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