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Method for making hole connection layer, method for making circuit board and circuit board

A manufacturing method and connection layer technology, which are applied in the directions of electrical connection of printed elements, formation of electrical connection of printed elements, printed circuits, etc., can solve the problems of difficult control of copper thickness and uniformity of the outer layer of the daughter board, and prevent excessive glue flow. , the effect of improving the bonding strength

Active Publication Date: 2019-11-08
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology

[0004] However, the traditional Via bond process still has defects: when the sub-board is made of POFV (plated on filled via, electroplating on the hole) process, it is difficult to control the thickness and uniformity of the outer layer of the sub-board copper, which is generally controlled at an average value of 30 μm to 40 μm. Range ±5μm

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  • Method for making hole connection layer, method for making circuit board and circuit board
  • Method for making hole connection layer, method for making circuit board and circuit board
  • Method for making hole connection layer, method for making circuit board and circuit board

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[0033] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0034] The motherboard is generally formed by laminating at least two sub-boards 100 stacked up and down in sequence, and a via bond layer (via bond layer) is provided between two adjacent sub-boards 100 . Such as figure 1 and Figure 6 Shown, the preparation method of hole connection layer of the present invention, comprises the following steps:

[0035] S210, in two adjacent sub-boards 100, affix the first insulating medium layer 200 for pressure-bonding and glue filling on a side of one of the sub-boards 100 facing the other adjacent sub-board 10...

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Abstract

The invention discloses a method for making a hole connection layer, a method for making a circuit board, and the circuit board. The method for making the hole connection layer includes the following steps: affixing a first substrate for pressing and filling glue on one of the sub-boards. Insulating medium layer; pressing and curing the first insulating medium layer located on the sub-board; attaching a second insulating medium layer for pressing and filling glue on the first insulating medium layer after pressing and curing; on the first insulating medium The first receiving hole is made on the second insulating medium layer, and the second receiving hole is made on the second insulating medium layer. The first receiving hole and the second receiving hole are set up and down oppositely; the conductive medium is filled in the first receiving hole and the second receiving hole, and the completion Fabrication of hole connection layer. The invention can not only meet the requirement of double-sided glue filling, improve the bonding strength of two adjacent sub-boards, but also control the fluidity of the hole connection layer, prevent excessive glue flow, damage the hole shape of the receiving hole, and ensure the conductive medium Not to be squeezed and washed away.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a hole connection layer, a method for manufacturing a circuit board and the circuit board. Background technique [0002] With the development and construction of the communication industry, high-level backplanes have been gradually applied. With the increase of various networked consumer products in the future, there will be requirements for greater capacity and higher speed of information transmission. The future 5G network construction will inevitably require a backplane that can carry more daughter boards, less signal loss, and higher reliability. The manufacturing technology of ultra-high-density and higher-layer backplane will be a development direction of the printed circuit industry in the future. [0003] The Via bond (hole connection) process is a Z-direction arbitrary interconnection technology between layers. It is to bond a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K1/11
CPCH05K1/115H05K3/429H05K2201/095H05K3/4614H05K2203/061H05K3/0047H05K3/027H05K3/4611
Inventor 廉泽阳吴森李艳国陈蓓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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