Telescopic pressing nail capable of being positioned

Abstract

The present invention discloses a telescopic pressing nail capable of being positioned. An extrusion head is arranged at the lower end of an insertion rod, a first limiting block is arranged at the upper end of the insertion rod, a column sleeve is arranged on the outer side of the upper portion of the insertion rod in a sleeving mode, a plurality of first sliding ways are arranged on the side wall of the column sleeve, and the upper ends of the first sliding ways are connected with first horizontal clamping parts in a penetrating mode; and a spring is arranged on one side of the inserting rod, and the upper end of the spring is connected with the turncap. In an initial state, the spring is not compressed, the extrusion head at the lower end of the insertion rod extends out towards the bottom to the maximum extent, when the cooling fin is installed downwards, the extrusion head firstly makes contact with a board clamping hole for alignment, and at the moment, the turncap is pressed downwards until the extrusion head of the insertion rod penetrates through the board clamping hole of the PCB; and the first limiting block is clamped in the first horizontal clamping part for locking by rotating the turncap, so that the lower space of the PCB is ensured, the positioning effect of the pressing nail is realized, and components on the board card are prevented from being damaged when the radiating fin is installed.

Description

technical field [0001] The invention belongs to the technical field of radiating fin assembly, and in particular relates to a positionable telescopic pressing nail. Background technique [0002] In the server field, some boards need to install heat sinks above the chip. The existing heat sink installation technology is to blindly install the heat sink from the top of the chip to the bottom, and then press the push pin to the corresponding opening on the board end. Such as figure 1 As shown, a spring is set on the outside of the pressing nail. In the initial state, the extrusion head at the lower part of the pressing nail is under the elastic force of the spring. The output part is too short, so that when the bottom surface of the heat sink touches the upper surface of the chip, the lower end of the extrusion head cannot extend into the board hole of the PCB, and thus the positioning effect cannot be achieved. It is necessary to manually adjust the position of the nail for m...

AI Technical Summary

Problems solved by technology

[0002] In the server field, some boards need to install heat sinks above the chip. The existing heat sink installation technology is to blindly install the heat sink from the top of the chip to the bottom, and then press the push pin to the corresponding opening on the board end. like figure 1 As shown, a spring is set on the outside of the pressing nail. In the initial state, the extrusion head at the lower part of the pressing nail is under the elastic force of the spring. The output part is too short, so that when the bottom surface of the heat sink touches the upper surface of the chip, the lower end of the extrusion head cannot extend into the board hole of the PCB, and thus the positioning effect cannot be achieved. It is necessary to manually adjust the position of the nail for many times and press it tentatively Press the nail to accurately insert into the hole

This operation method is easy to touch the components on the board, causing damage to the components

Generally, the positioning effect can also be achieved by simply extending the length of the extrusion head, but this will increase the space between the board and the bottom of the tray. Due to the limitation of the server design space, this solution has great limitations

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