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Rotary magnetron sputtering with individually adjustable magnetic field

A technology of magnetron sputtering and magnetron, which is applied in the deposition of magnetron sputtering coating, using the field of magnetron sputtering coating deposition of rotating sputtering cathode, can solve the problems of precise control and limitation, and achieve the improvement of precision, Improve efficiency, improve efficiency and the effect of accuracy

Pending Publication Date: 2021-12-03
INTERPANE ENTWICKLUNGS UND BERATUNGSGESELLSCHAFT MBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This limits the precise control of the shape and strength of the magnetic field at specific locations and thus the possibility of precisely controlling the plasma intensity and thus locally varying the coating inhomogeneity

Method used

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  • Rotary magnetron sputtering with individually adjustable magnetic field
  • Rotary magnetron sputtering with individually adjustable magnetic field
  • Rotary magnetron sputtering with individually adjustable magnetic field

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Embodiment Construction

[0038] The present invention will be described in conjunction with specific embodiments and with reference to certain drawings, but the present invention is not limited thereto. In the description and claims, the indefinite article one or one does not exclude a plural number. Furthermore, the terms first, second, etc. in the description and claims are used to distinguish similar elements and not necessarily to describe an order temporally, spatially, hierarchically or in any other way. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.

[0039] In addition, the terms upper, lower, etc. in the specification and claims are generally used for descriptive purposes, not necessarily for comprehensively describing exclusive relative positions. It is to be understood that any of the foregoing terms ...

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Abstract

A magnetron assembly (202) for magnetron sputtering with rotary cathode systems is provided. The magnetron assembly (202) comprises a plurality of magnets (205) attached to a plurality of yokes (206) and a plurality of driving modules (207), each comprising an actuating mechanism (208) operatively coupled to at least one of the plurality of yokes (206). The plurality of driving modules (207) are adapted for adjusting the position of the plurality of yokes (206) individually.

Description

technical field [0001] The invention belongs to the field of magnetron sputtering coating deposition, especially the field of magnetron sputtering coating deposition using rotating sputtering cathode. More specifically, a major but non-limiting scope of application of the present invention refers to the coating of films on a wide variety of substrates such as glass. Background technique [0002] Magnetron sputtering using a rotating cathode has long been used in the glass coating industry because it has been proven to maximize target material utilization while producing uniform coatings. This is achieved by rotating the target tube around a stationary magnetron placed inside the tube. This magnetron aligns the substrate within a vacuum chamber, generating and maintaining a plasma at the desired location to coat the target onto the substrate. [0003] However, due to target corrosion, the distance between the target surface and the magnet decreases. As a result, the streng...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/34C23C14/35
CPCH01J37/3405H01J37/3455C23C14/35H01J37/347C23C14/54H01J37/342H01J37/3435
Inventor A·珀勒D·瓦格纳
Owner INTERPANE ENTWICKLUNGS UND BERATUNGSGESELLSCHAFT MBH & CO KG