Limiting jig and limiting press-fit device

Abstract

The invention relates to a limiting jig and a limiting press-fit device. The limiting press-fit device comprises the limiting jig and a pressure supply mechanism connected with the limiting jig, and the limiting jig comprises an upper die, a lower die and a limiting mechanism, wherein the upper die and the lower die are opposite up and down and can move up and down, and the limiting mechanism is arranged between the upper die and the lower die. The limiting jig is mainly provided with a limiting assembly at a workpiece alignment opening of a limiting module, and the upper die is provided with corresponding pressing and abutting assemblies at the positions corresponding to limiting assemblies. Therefore, the limiting jig and the limiting press-fit device can mainly utilize limiting structures of the limiting mechanism to be matched with pressing and abutting structures of the upper die, and thus in the press-fit operation process, the upper part and the lower part of a workpiece can be respectively pushed and positioned through pushing parts of the limiting structures, so that not only can the device be suitable for the press-fit operation of workpieces with various sizes, but also the size precision requirement of the workpiece alignment opening can be reduced, and the production cost of the dies can be further reduced.

Description

technical field [0001] The invention relates to a position-limiting jig and a position-limiting pressing device, in particular to a position-limiting jig and a position-limiting pressing device for positioning substrates and cooling fins such as semiconductor elements and providing pressing operations. Background technique [0002] With the advancement of science and technology, people's requirements for information processing speed have increased, and the existing semiconductor components are gradually developing towards high frequency, and high-frequency semiconductor components are prone to high temperatures during operation. Therefore, in order to avoid damage to semiconductor components due to high temperatures Or the problem of performance degradation. In addition to the cooling effect provided by the external heat dissipation structure, the semiconductor element will press a heat sink with improved heat dissipation function on the substrate with the semiconductor chip ...

AI Technical Summary

Problems solved by technology

[0004] Wherein, a limit mold is set between the upper mold and the lower mold of the pressing fixture, and a workpiece alignment mold is formed on the limit mold. The side wall of the workpiece alignment port is formed with a guide slope that is inclined from the inside to the outside. The design of the guide slope inclined from the inside to the outside, so that the guide slope can push the heat sink during the pressing action, so that the heat sink and the substrate are automatically aligned. However, by using the workpiece When the alignment port provides the alignment function, the workpiece alignment port must match the shape design of the semiconductor element, and the dimensional accuracy of the workpiece alignment port is required to be high, resulting in higher mold manufacturing costs

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