A highly filled ultrahigh thermal conductivity epoxy resin material and its preparation method
An epoxy resin, ultra-high technology, applied in the field of high-filled ultra-high thermal conductivity epoxy resin materials and preparation, can solve the problem of thermal conductivity not meeting the needs of use, achieve good thermal conductivity, ensure stability, and ensure the effect of the process
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[0050] The preparation method of high-filled ultra-high thermal conductivity epoxy resin material comprises the following steps:
[0051] First, 15-25% of boron nitride with particle size of 30-70nm, 50-65% of large particle size aluminum oxide with particle size of 80-120μm, 6-14% of small particle size type with particle size of 40-60nm Al2O3, 10-20% aluminum nitride with a particle size of 10-30nm, and 4-8% zinc oxide thermally conductive powder with a particle size of 80-120nm are mixed evenly according to the proportions and then poured into the tray and placed in the oven. Dehumidify at 145°C for 120-200min, followed by natural cooling in an oven. The humidity of the oven room is below 30%, and the composite thermally conductive powder is obtained after drying.
[0052] Next, pour the composite thermally conductive powder into a milling, dispersing and modifying integrated machine, add a titanium / aluminate coupling agent, aliphatic epoxy resin, and also add a silane cou...
Embodiment 1
[0056] A high-filled ultra-high thermal conductivity epoxy resin material is prepared from A component and B component; A component is a mixture of epoxy resin base material and modified thermal conductive powder; B component is made of curing agent, accelerator A mixture of mixing auxiliaries and modified heat-conducting powders composed of an agent and a toughening agent; the mass percentage ratio of curing agent, accelerator and toughening agent is 2:1.5:1.
[0057] Among them, the epoxy resin base material is tetrabromobisphenol A epoxy resin; the curing agent is an acid anhydride curing agent, which is methyl hexahydroacid anhydride; the accelerator is an imidazole polymer; the toughening agent is an active toughening agent; The active toughener is a prepolymer polyurethane.
[0058] The mass percentage ratio of the A component to the B component is 1:1; the mass percentage ratio of the epoxy resin binder and the modified thermal conductive powder in the A component is 10...
Embodiment 2
[0067] A high-filled ultra-high thermal conductivity epoxy resin material is prepared from A component and B component; A component is a mixture of epoxy resin base material and modified thermal conductive powder; B component is made of curing agent, accelerator The mixture of the mixed auxiliary agent and the modified thermal conductive powder composed of the agent and the toughening agent; the mass percentage ratio of the curing agent, the accelerator and the toughening agent is 2.5:1.5:1.
[0068] Among them, the epoxy resin is hydrogenated bisphenol A epoxy resin; the curing agent is an acid anhydride curing agent, which is methyl tetrahydroic anhydride; the accelerator is a complex cation; the toughening agent is an active toughening agent; The agents are polythiol and prepolymer polyurethane.
[0069]The mass percentage ratio of A component to the B component is 1.2:1; the mass percentage ratio of epoxy resin base material and modified thermal conductive powder in A comp...
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