A highly filled ultrahigh thermal conductivity epoxy resin material and its preparation method

An epoxy resin, ultra-high technology, applied in the field of high-filled ultra-high thermal conductivity epoxy resin materials and preparation, can solve the problem of thermal conductivity not meeting the needs of use, achieve good thermal conductivity, ensure stability, and ensure the effect of the process

Active Publication Date: 2022-02-08
苏州森孚感知科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the invention focuses on improving the mechanical properties of the material rather than the thermal conductivity in the case of high filling, and the thermal conductivity of the prepared material cannot meet the use requirements when used in electrical equipment

Method used

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  • A highly filled ultrahigh thermal conductivity epoxy resin material and its preparation method
  • A highly filled ultrahigh thermal conductivity epoxy resin material and its preparation method

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preparation example Construction

[0050] The preparation method of high-filled ultra-high thermal conductivity epoxy resin material comprises the following steps:

[0051] First, 15-25% of boron nitride with particle size of 30-70nm, 50-65% of large particle size aluminum oxide with particle size of 80-120μm, 6-14% of small particle size type with particle size of 40-60nm Al2O3, 10-20% aluminum nitride with a particle size of 10-30nm, and 4-8% zinc oxide thermally conductive powder with a particle size of 80-120nm are mixed evenly according to the proportions and then poured into the tray and placed in the oven. Dehumidify at 145°C for 120-200min, followed by natural cooling in an oven. The humidity of the oven room is below 30%, and the composite thermally conductive powder is obtained after drying.

[0052] Next, pour the composite thermally conductive powder into a milling, dispersing and modifying integrated machine, add a titanium / aluminate coupling agent, aliphatic epoxy resin, and also add a silane cou...

Embodiment 1

[0056] A high-filled ultra-high thermal conductivity epoxy resin material is prepared from A component and B component; A component is a mixture of epoxy resin base material and modified thermal conductive powder; B component is made of curing agent, accelerator A mixture of mixing auxiliaries and modified heat-conducting powders composed of an agent and a toughening agent; the mass percentage ratio of curing agent, accelerator and toughening agent is 2:1.5:1.

[0057] Among them, the epoxy resin base material is tetrabromobisphenol A epoxy resin; the curing agent is an acid anhydride curing agent, which is methyl hexahydroacid anhydride; the accelerator is an imidazole polymer; the toughening agent is an active toughening agent; The active toughener is a prepolymer polyurethane.

[0058] The mass percentage ratio of the A component to the B component is 1:1; the mass percentage ratio of the epoxy resin binder and the modified thermal conductive powder in the A component is 10...

Embodiment 2

[0067] A high-filled ultra-high thermal conductivity epoxy resin material is prepared from A component and B component; A component is a mixture of epoxy resin base material and modified thermal conductive powder; B component is made of curing agent, accelerator The mixture of the mixed auxiliary agent and the modified thermal conductive powder composed of the agent and the toughening agent; the mass percentage ratio of the curing agent, the accelerator and the toughening agent is 2.5:1.5:1.

[0068] Among them, the epoxy resin is hydrogenated bisphenol A epoxy resin; the curing agent is an acid anhydride curing agent, which is methyl tetrahydroic anhydride; the accelerator is a complex cation; the toughening agent is an active toughening agent; The agents are polythiol and prepolymer polyurethane.

[0069]The mass percentage ratio of A component to the B component is 1.2:1; the mass percentage ratio of epoxy resin base material and modified thermal conductive powder in A comp...

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Abstract

The invention belongs to the technical field of heat-conducting materials under the ultra-high heat-conducting filling technology system, and specifically relates to a high-filling and ultra-high heat-conducting epoxy resin material and a preparation method thereof. The material is made of A component and B component, A component is a mixture of epoxy resin base material and modified thermal conductive powder; B component is a mixture of mixing aid and modified thermal conductive powder; A component The mass percentage ratio of the epoxy resin base material to the modified thermal conductive powder is 100: (65‑95); the mass percentage ratio of the mixing aid to the modified thermal conductive powder in component B is 100: (65‑95) ; The mass percentage ratio of the A component to the B component is (0.8-1.2): 1; the modified heat-conducting powder is a composite heat-conducting powder modified by a modifier. The invention effectively improves the compatibility between the powder and the epoxy resin substrate by modifying the composite heat-conducting powder with different particle sizes, so that the thermal conductivity is ≥ 2.5W·m ‑1 ·K ‑1 , volume resistivity ≥ 2.2×10 15 Ω·cm, breakdown strength ≥24V / mm.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting insulating materials, and in particular relates to a high-filling ultra-high heat-conducting epoxy resin material and a preparation method thereof. Background technique [0002] With the dry-type transformers, dry-type core reactors under the glass mesh cloth process, dry-type transformers, pot insulators, dry-type bushings and other electrical equipment under the vacuum drawing process and vacuum extrusion process, the insulation materials The requirements for thermal conductivity are getting higher and higher, how to improve the thermal conductivity of materials has become the focus of current research. Adding high thermal conductivity powder fillers to epoxy resin is a commonly used method to improve the thermal conductivity of materials. Although metal powder is often used to try to improve the thermal conductivity of epoxy resin, the insulation of metal powder to epoxy resin Performa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L75/08C08K9/10C08K3/38C08K3/22C08K3/28
CPCC08L63/00C08K2003/2227C08K2201/014C08K2201/005C08K2003/2296C08K2003/385C08K2003/282C08L75/08C08K9/10C08K3/38C08K3/22C08K3/28
Inventor 舒孚
Owner 苏州森孚感知科技有限公司
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