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Method for transferring Mini or Micro LED chip to PCB

A PCB board and chip transfer technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as low work efficiency, and achieve the effects of improving efficiency, reducing usage, and reducing sorting and transfer costs.

Pending Publication Date: 2021-12-10
江西兆驰晶显有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a method for transferring Mini or Micro LED chips to PCB boards, which solves the technical problem of low work efficiency in transferring Mini or Micro LED chips to PCB boards

Method used

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  • Method for transferring Mini or Micro LED chip to PCB
  • Method for transferring Mini or Micro LED chip to PCB
  • Method for transferring Mini or Micro LED chip to PCB

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Embodiment Construction

[0037] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings. Among them, the orientation nouns such as "up" and "down" mentioned in this article are preceded by figure 1 orientation as a reference.

[0038] In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be more clearly and thoroughly understood, and the scope of the present invention can be fully conveyed to those skilled in the art.

[00...

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Abstract

The invention relates to a method for transferring Mini or Micro LED chip to a PCB. The method comprises the steps that firstly, carrying out parameter spot measurement on all LED chips of a large wafer to obtain spot measurement data; 2, storing the spot measurement data in a computer, and converting the spot measurement data into an MAPPING graph through a computer program; and 3, reading the MAPPING image, determining BIN section intervals to which all the LED chips on the large wafer belong based on spot measurement data in the MAPPING image, and transferring the LED chip sections in the same BIN section interval to the same PCB by using a die bonder. The large wafers are directly transferred to the PCB without being tested and sorted, so that the use amount of blue films is reduced, and materials are saved; and the step of transferring the chips on the blue film to the substrate is reduced, so that the sorting and transferring cost and the sorting and transferring time are reduced, and the efficiency is greatly improved. The MAP on the large wafer is directly read, and the LED chips in the same BIN section are selected and transferred to the matched PCB, so that the crystal mixing effect is better, the efficiency is improved, and the blue film replacement time is shortened.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for transferring Mini or Micro LED chips to a PCB. Background technique [0002] A micro light-emitting diode display is a display that uses a high-density micro-sized LED array integrated on a substrate as a display pixel to realize image display. Micro-light-emitting diode displays are the same as large-scale outdoor LED displays. Each pixel can be addressed and individually driven to light up. It can be regarded as a reduced version of the outdoor LED display, reducing the pixel distance from millimeters to microns. Due to the miniaturization of components, there are many problems to be overcome or improved, and the transfer technology in the production process is the key to whether the product can be mass-produced and meet the standard of commercial products. [0003] At present, most of the production methods of LED modules are to use a crystal bonder to transfer ...

Claims

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Application Information

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IPC IPC(8): H01L27/15H01L21/67
CPCH01L27/156H01L21/67144
Inventor 李铁军熊周成刘君宏
Owner 江西兆驰晶显有限公司
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