Reaction tank and wet process equipment

A technology of reaction tank and reaction chamber, which is applied in the field of panel manufacturing, can solve problems such as substrate development or etching unevenness and lower product yield, so as to prevent substrate development or etching unevenness, improve product yield, reduce The effect of attachment

Pending Publication Date: 2021-12-21
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a reaction tank and wet process equipment to solve the problem of poor development or etching of the substrate after the water droplets and particle dirt accumulated on the cover plate surface of the reaction tank in the existing equipment fall onto the substrate. Uniform, reducing the problem of product yield

Method used

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  • Reaction tank and wet process equipment
  • Reaction tank and wet process equipment
  • Reaction tank and wet process equipment

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Embodiment Construction

[0026] The following describes the preferred embodiments of the present invention with reference to the accompanying drawings to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied by many different forms of invention embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned herein.

[0027] In the drawings, components with the same structure are denoted by the same numerals, and components with similar structures or functions are denoted by similar numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of parts is appropriately exaggerated in some ...

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PUM

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Abstract

The invention provides a reaction tank and wet process equipment. The reaction tank comprises a tank body, a cover plate and an air supply device, wherein the cover plate is arranged at a tank opening of the tank body; the cover plate is of a hollow structure, and an air cavity is formed in the cover plate; a plurality of air outlet holes are formed in the surface, facing the tank body, of the cover plate, and the air outlet holes communicate with the air cavity; and the air supply device communicates with the air cavity and used for conveying air into the air cavity.

Description

technical field [0001] The invention relates to the field of panel manufacturing, in particular to a reaction tank and wet process equipment. Background technique [0002] In the manufacturing process of the display screen, the specific film layer on the substrate is usually developed and etched in different reaction tanks with different functional chemicals such as developer solution and etching solution. During the wet etching process, the vapor formed with the volatilization of the chemical solution gradually adheres to the cover plate of the reaction tank to form water droplets. The water droplets continue to gather and drop to the substrate in the tank, resulting in the development or engraving of the film layer. Erosion is uneven. In addition, as the working hours prolong, a large amount of particle dirt will accumulate on the surface of the slot cover, and it will also fall onto the panel with water droplets, affecting the product yield. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B5/02H01L21/67
CPCB08B5/02H01L21/67023H01L21/67075
Inventor 贺晖
Owner SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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